Inventor · disambiguated record
Qiao Chen
Also filed as: CHEN QIAO · CHEN QIAO-LONG
11 granted patents·11 pending applications·96 citations·filing 2006–2025
88Inventor score
Files withSHENZHEN STS MICROELECTRONICS CO LTD6TEXAS INSTRUMENTS INC6CHAMP TECH OPTICAL FOSHAN CORP3CHEN QIAO-LONG2FOXCONN TECH CO LTD1
Top patents by PatentIndex Score
22 records- 0192US9275934B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameSUNDARAM VENKATESH·Filed 2011·Granted Mar 1, 2016·43 cites·17 claims
- 0291US10477731B1Liquid-cooled radiatorCHAMP TECH OPTICAL FOSHAN CORP·Filed 2019·Granted Nov 12, 2019·14 cites·18 claims
- 0390US7277281B1Heat dissipation device having wire fixtureFOXCONN TECH CO LTD·Filed 2006·Granted Oct 2, 2007·24 cites·12 claims
- 0489US11942386B2Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 26, 2024·2 cites·17 claims
- 0588US10672718B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameGEORGIA TECH RES INST·Filed 2016·Granted Jun 2, 2020·6 cites·18 claims
- 0687US10108237B1Heat dissipating device with improved cooling performanceCHAMP TECH OPTICAL FOSHAN CORP·Filed 2017·Granted Oct 23, 2018·6 cites·15 claims
- 0782US12255115B2Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2024·Granted Mar 18, 2025·0 cites·21 claims
- 0875US2025218886A1Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0969US11094611B2Liquid cooled heat dissipation deviceCHAMP TECH OPTICAL FOSHAN CORP·Filed 2019·Granted Aug 17, 2021·1 cites·13 claims
- 1058US2025226301A1Multilayer substrates, power modules, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1158US2025226273A1Multilayer substrates and methods for manufacturing same, power modules and methods for manufacturing same, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1257US2025246506A1Electronic device with thermally conductive material in semiconductor die trenchTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1356US11855024B2Wafer chip scale packages with visible solder filletsTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 26, 2023·0 cites·22 claims
- 1456US2025220814A1Multilayer printed circuit board for interconnecting pin(s) and semiconductor die(s) and corresponding method for interconnectionSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1556US2025372569A1Semiconductor apparatus, manufacturing methods, and electrical systemsST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 1656US2025218954A1Package, manufacturing method thereof and electrical systemSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1753US2025006633A1Interconnect package, method of forming the same and power moduleSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1849US12009319B2Integrated circuit with metal stop ring outside the scribe sealTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 11, 2024·0 cites·19 claims
- 1949US2024203843A1Semiconductor package, package forming method, and power supply moduleSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2036US2012261805A1Through package via structures in panel-based silicon substrates and methods of making the sameSUNDARAM VENKATESH V·Filed 2012·Application pending·0 cites
- 2129US9138840B2Method for manufacturing a heat sinkCHEN QIAO-LONG·Filed 2012·Granted Sep 22, 2015·0 cites·7 claims
- 2228US2013255929A1Heat dissipation deviceCHEN QIAO-LONG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →