Inventor · disambiguated record
Qianwen Chen
Also filed as: CHEN QIANWEN
43 granted patents·14 pending applications·61 citations·filing 2015–2024
96Inventor score
Top patents by PatentIndex Score
57 records- 0198US10217637B1Chip handling and electronic component integrationIBM·Filed 2017·Granted Feb 26, 2019·35 cites·13 claims
- 0292US12014816B2Multi-sensor platform for health monitoringIBM·Filed 2020·Granted Jun 18, 2024·3 cites·20 claims
- 0389US10490525B1High speed handling of ultra-small chips by selective laser bonding and debondingIBM·Filed 2018·Granted Nov 26, 2019·5 cites·16 claims
- 0489US9735077B1Heterogeneous miniaturization platformIBM·Filed 2016·Granted Aug 15, 2017·5 cites·10 claims
- 0586US10658182B2Chip handling and electronic component integrationIBM·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 0686US10530150B2Air gap metal tip electrostatic discharge protectionIBM·Filed 2017·Granted Jan 7, 2020·2 cites·7 claims
- 0783US10833296B2Thin film solid-state microbattery packagingIBM·Filed 2017·Granted Nov 10, 2020·1 cites·6 claims
- 0881US10395929B2Chip handling and electronic component integrationIBM·Filed 2017·Granted Aug 27, 2019·2 cites·14 claims
- 0980US11101513B2Thin film battery packagingIBM·Filed 2018·Granted Aug 24, 2021·1 cites·18 claims
- 1080US10380284B2Heterogeneous miniaturization platformIBM·Filed 2017·Granted Aug 13, 2019·2 cites·5 claims
- 1177US11133670B2Air gap metal tip electrostatic discharge protectionIBM·Filed 2019·Granted Sep 28, 2021·0 cites·13 claims
- 1276US11539080B2Miniaturized electronics package with patterned thin film solid state batteryIBM·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 1376US10535994B2Air gap metal tip electrostatic discharge protectionIBM·Filed 2017·Granted Jan 14, 2020·1 cites·11 claims
- 1470US11539081B2Miniaturized electronics package with patterned thin film solid state batteryIBM·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 1569US11165248B2Air gap metal tip electrostatic discharge protectionIBM·Filed 2019·Granted Nov 2, 2021·0 cites·16 claims
- 1669US10407791B2Selective solder platingIBM·Filed 2017·Granted Sep 10, 2019·0 cites·7 claims
- 1768US2025372956A1Silicon photonic platformIBM·Filed 2024·Application pending·0 cites
- 1867US11522243B2Hermetic packaging of a micro-battery deviceIBM·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 1967US11311224B2Flexible silicon nanowire electrodeIBM·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 2067US11171374B2Thin film solid-state microbattery packagingIBM·Filed 2017·Granted Nov 9, 2021·0 cites·13 claims
- 2164US12300615B2Infrared debond damage mitigation by copper fill patternIBM·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 2264US10784380B2Gate-all-around transistor based non-volatile memory devicesIBM·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 2363US10651036B2Chip handling and electronic component integrationIBM·Filed 2019·Granted May 12, 2020·0 cites·9 claims
- 2462US11055459B2Heterogeneous miniaturization platformIBM·Filed 2019·Granted Jul 6, 2021·0 cites·19 claims
- 2562US2025301670A1Metal-insulator-metal capacitor structureIBM·Filed 2024·Application pending·0 cites
- 2662US2025318248A1Deep via structures for stacked transistor devicesIBM·Filed 2024·Application pending·0 cites
- 2762US2025344411A1Logic and cache hybrid bondingIBM·Filed 2024·Application pending·0 cites
- 2862US2025308936A1Coaxial via formation with sidewall contactsIBM·Filed 2024·Application pending·0 cites
- 2961US10651507B2Miniaturized electronics package with patterned thin film solid state batteryIBM·Filed 2017·Granted May 12, 2020·0 cites·6 claims
- 3061US2025370184A1On-chip optical through-silicon viaIBM·Filed 2024·Application pending·0 cites
- 3160US11908723B2Silicon handler with laser-release layersIBM·Filed 2021·Granted Feb 20, 2024·0 cites·24 claims
- 3260US10637101B2Miniaturized electronics package with patterned thin film solid state batteryIBM·Filed 2017·Granted Apr 28, 2020·0 cites·14 claims
- 3360US10610117B2Flexible silicon nanowire electrodeIBM·Filed 2017·Granted Apr 7, 2020·0 cites·5 claims
- 3460US10505160B2Micro-battery using glass packageIBM·Filed 2017·Granted Dec 10, 2019·0 cites·18 claims
- 3560US2025201667A1Cooling for back side power distribution networkIBM·Filed 2023·Application pending·0 cites
- 3659US11876233B2Thin film battery stackingIBM·Filed 2020·Granted Jan 16, 2024·0 cites·17 claims
- 3759US10586875B2Gate-all-around transistor based non-volatile memory devicesIBM·Filed 2018·Granted Mar 10, 2020·0 cites·9 claims
- 3858US11058337B2Flexible silicon nanowire electrodeIBM·Filed 2017·Granted Jul 13, 2021·0 cites·14 claims
- 3958US10964925B2Hermetial via seal for thin film batteryIBM·Filed 2019·Granted Mar 30, 2021·0 cites·17 claims
- 4058USD886684ST bar chainCHEN QIANWEN·Filed 2020·Granted Jun 9, 2020·3 cites·1 claims
- 4158US2025199253A1Bidirectional wafer-level light couplingIBM·Filed 2023·Application pending·0 cites
- 4258US2025341348A1Thermoelectric cooler integrationIBM·Filed 2024·Application pending·0 cites
- 4357US11222862B2High speed handling of ultra-small chips by selective laser bonding and debondingIBM·Filed 2019·Granted Jan 11, 2022·0 cites·13 claims
- 4457US2025048730A1Release layer containing semiconductor-on-insulator substratesIBM·Filed 2023·Application pending·0 cites
- 4555US2024264392A1Co-package optics assemblyIBM·Filed 2023·Application pending·0 cites
- 4653US11094407B2Electronics miniaturization platform for medication verification and trackingIBM·Filed 2019·Granted Aug 17, 2021·0 cites·19 claims
- 4753US10658973B2Reconfigurable allocation of VNCAP inter-layer vias for co-tuning of L and C in LC tankIBM·Filed 2018·Granted May 19, 2020·0 cites·19 claims
- 4853US2019326190A1Wafer stacking for integrated circuit manufacturingIBM·Filed 2019·Application pending·0 cites
- 4952US11119504B2Machine learning based airflow sensing for aircraftIBM·Filed 2018·Granted Sep 14, 2021·0 cites·20 claims
- 5050US2023087366A1Carrier wafer with multiple antireflective coating layersIBM·Filed 2021·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →