Inventor · disambiguated record
Qingwen Deng
Also filed as: DENG QINGWEN
10 granted patents·1 pending application·100 citations·filing 2001–2024
85Inventor score
Top patents by PatentIndex Score
11 records- 0195US11705437B1Interconnection structure of system on wafer and PCB base on TSV process and method for manufacturing the sameZhejiang Lab·Filed 2023·Granted Jul 18, 2023·4 cites·9 claims
- 0291US11748552B2Integrated circuit design using fuzzy machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·2 cites·20 claims
- 0391US6760873B1Built-in self test for speed and timing margin for a source synchronous IO interfaceLSI LOGIC CORP·Filed 2001·Granted Jul 6, 2004·88 cites·56 claims
- 0488US12131108B2Systems and methods for integrated circuit layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·1 cites·20 claims
- 0586US11537773B2Systems and methods for integrated circuit layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 27, 2022·2 cites·20 claims
- 0677US11392748B2Integrated circuit design using fuzzy machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 19, 2022·3 cites·20 claims
- 0777US2024354486A1Integrated circuit design using fuzzy machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0876US12050853B2Integrated circuit design using fuzzy machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 0967US11853667B2Systems and methods for integrated circuit layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1058US12112991B1System on wafer assembly structure and assembly method thereofZhejiang Lab·Filed 2023·Granted Oct 8, 2024·0 cites·6 claims
- 1151US11983481B2Software-defined wafer-level switching system design method and apparatusZhejiang Lab·Filed 2023·Granted May 14, 2024·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →