Inventor · disambiguated record
Qiyin Lin
Also filed as: LIN QIYIN
1 granted patent·1 pending application·0 citations·filing 2010–2022
10Inventor score
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2 records- 0142US2022275473A1Connection performance uniformity improving method for assembly joint surface based on partition hardeningUNIV XI AN JIAOTONG·Filed 2022·Application pending·0 cites
- 0240US8545991B2Low thermal conductivity misfit layer compounds with layer to layer disorderJOHNSON DAVID C·Filed 2010·Granted Oct 1, 2013·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →