Inventor · disambiguated record
Qingmin Liu
Also filed as: LIU QINGMIN
21 granted patents·5 pending applications·105 citations·filing 2014–2024
93Inventor score
Files withGLOBALWAFERS CO LTD14SUNEDISON SEMICONDUCTOR LTD UEN201334164H10GLOBALWAFERS CO INC1SUNEDISON INC1
Top patents by PatentIndex Score
26 records- 0198US9202711B2Semiconductor-on-insulator wafer manufacturing method for reducing light point defects and surface roughnessSUNEDISON INC·Filed 2014·Granted Dec 1, 2015·66 cites·20 claims
- 0290US10468295B2High resistivity silicon-on-insulator structure and method of manufacture thereofSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2017·Granted Nov 5, 2019·7 cites·16 claims
- 0389US10224233B2High resistivity silicon-on-insulator substrate comprising a charge trapping layer formed by He-N2 co-implantationSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2015·Granted Mar 5, 2019·5 cites·21 claims
- 0489US10072892B2Semiconductor wafer support ring for heat treatmentSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2016·Granted Sep 11, 2018·5 cites·3 claims
- 0588US11145538B2High resistivity silicon-on-insulator structure and method of manufacture thereofGLOBALWAFERS CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·24 claims
- 0686US10403541B2High resistivity silicon-on-insulator substrate comprising a charge trapping layer formed by He—N2 co-implantationSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2018·Granted Sep 3, 2019·3 cites·25 claims
- 0785US10312134B2High resistivity silicon-on-insulator wafer manufacturing method for reducing substrate lossSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2015·Granted Jun 4, 2019·3 cites·11 claims
- 0884US11798802B2Methods for stripping and cleaning semiconductor structuresGLOBALWAFERS CO LTD·Filed 2022·Granted Oct 24, 2023·2 cites·13 claims
- 0981US9853133B2Method of manufacturing high resistivity silicon-on-insulator substrateSUNEDISON SEMICONDUCTOR LTD (UEN201334164H)·Filed 2015·Granted Dec 26, 2017·4 cites·32 claims
- 1079US12424471B2Wafer boats for supporting semiconductor wafers in a furnaceGLOBALWAFERS CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·19 claims
- 1178US10811308B2High resistivity silicon-on-insulator wafer manufacturing method for reducing substrate lossGLOBALWAFERS CO INC·Filed 2018·Granted Oct 20, 2020·2 cites·32 claims
- 1276US10546771B2High resistivity silicon-on-insulator substrate having enhanced charge trapping efficiencySUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2017·Granted Jan 28, 2020·1 cites·37 claims
- 1373US11239107B2High resistivity silicon-on-insulator substrate having enhanced charge trapping efficiencyGLOBALWAFERS CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·19 claims
- 1471US10832937B1High resistivity silicon-on-insulator substrate having enhanced charge trapping efficiencyGLOBALWAFERS CO LTD·Filed 2020·Granted Nov 10, 2020·0 cites·20 claims
- 1570US11183420B2High resistivity silicon-on-insulator wafer manufacturing method for reducing substrate lossGLOBALWAFERS CO LTD·Filed 2020·Granted Nov 23, 2021·0 cites·30 claims
- 1669US10483379B2High resistivity silicon-on-insulator wafer manufacturing method for reducing substrate lossSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2018·Granted Nov 19, 2019·1 cites·24 claims
- 1767US10741437B2High resistivity silicon-on-insulator substrate having enhanced charge trapping efficiencyGLOBALWAFERS CO LTD·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 1865US9899499B2High resistivity silicon-on-insulator wafer manufacturing method for reducing substrate lossSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2015·Granted Feb 20, 2018·1 cites·17 claims
- 1964US12046495B2Wafer boats for supporting semiconductor wafers in a furnaceGLOBALWAFERS CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·14 claims
- 2063US10796945B2High resistivity silicon-on-insulator substrate comprising a charge trapping layer formed by He—N2 co-implantationGLOBALWAFERS CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 2162US2019259654A1High resistivity silicon-on-insulator wafer manufacturing method for reducing substrate lossGLOBALWAFERS CO LTD·Filed 2019·Application pending·0 cites
- 2255US10458709B2Semiconductor wafer support ring for heat treatmentGLOBALWAFERS CO LTD·Filed 2018·Granted Oct 29, 2019·0 cites·19 claims
- 2355US2025157847A1Systems and methods for bond treating and cleaving of silicon wafersGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 2455US2025069945A1Methods of preparing silicon-on-insulator structures using epitaxial wafersGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 2555US2024258155A1Methods of manufacturing semiconductor-on-insulator wafers having charge trapping layers with controlled stressGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
- 2636US2017025306A1Methods for preparing layered semiconductor structures and related bonded structuresSUNEDISON SEMICONDUCTOR LTD (UEN201334164H)·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →