Inventor · disambiguated record
Qiangjun Wang
Also filed as: WANG QIANGJUN
1 granted patent·9 pending applications·0 citations·filing 2023–2025
9Inventor score
Files withCONTEMPORARY AMPEREX TECHNOLOGY CO LTD5CONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD4CONTEMPORARY AMPEREX TECH HONK KONG LIMITED1
Top patents by PatentIndex Score
10 records- 0171US2025364524A1Coating die head and coating apparatus for electrode sheetCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0263US2025353032A1Coating die head, and coating device for electrode sheetCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0362US12460926B2Detection method, surface density device, detection means, and storage mediumCONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD·Filed 2023·Granted Nov 4, 2025·0 cites·11 claims
- 0462US2024153665A1Collimator, radioactive source kit, detector, surface density gauge, apparatus, and systemCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 0559US2025214102A1Coating die, coating apparatus, and coating methodCONTEMPORARY AMPEREX TECH HONK KONG LIMITED·Filed 2025·Application pending·0 cites
- 0655US2025277759A1Areal density detection apparatusCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0755US2024167928A1Surface density device calibration apparatus and surface density device calibration methodCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 0854US2025198952A1Device for electrode plate testingCONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD·Filed 2025·Application pending·0 cites
- 0951US2025155346A1Electrode plate testing method and apparatusCONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD·Filed 2025·Application pending·0 cites
- 1049US2025002286A1Strip threading apparatus and method for splicing strip material by using strip threading apparatusCONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →