Inventor · disambiguated record
Qiong Zhan
Also filed as: ZHAN QIONG
5 granted patents·7 pending applications·36 citations·filing 1998–2025
74Inventor score
Top patents by PatentIndex Score
12 records- 0183US11804458B2Method of fabricating integrated circuit deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Oct 31, 2023·1 cites·18 claims
- 0260US5995212ASystem and method for inspecting an optical fiber including an epoxy area surrounding the optical fiberCIENA CORP·Filed 1998·Granted Nov 30, 1999·23 cites·30 claims
- 0357US2024332079A1Dicing method, bonding method and dieWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 0457US2025254879A1Memory block, memory device, and memory cellWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 0555US2024414914A1Memory block and manufacture method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 0652US2023395440A1Method of handling test pad and method of fabricating semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 0752US2024145005A1Memory block and control method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 0849US12322707B2Large die wafer, large die and method of forming the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 0949US12322445B2Three dimensional semiconductor memory structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Granted Jun 3, 2025·0 cites·17 claims
- 1047US2024038631A1Three-dimensional integrated circuit module and fabrication method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 1146US2024172438A1Memory block, memory-cell group and memory deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 1243US6178285B1Vision system for inspecting interconnections of optical cards mounted in a rack and associated methodsCIENA CORP·Filed 1998·Granted Jan 23, 2001·12 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →