Inventor · disambiguated record
Qingyun Zhou
Also filed as: ZHOU QINGYUN
3 granted patents·1 pending application·0 citations·filing 2017–2022
43Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0152US11823911B2Process of package-then-etch three-dimensional package structure electrically connected by plated copper pillarsJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·18 claims
- 0249US2023187363A1Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2022·Application pending·0 cites
- 0341US11217459B2Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2017·Granted Jan 4, 2022·0 cites·8 claims
- 0428US10763128B2Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metalJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →