Inventor · disambiguated record
Qizhuo Zhuo
Also filed as: ZHUO QIZHUO
11 granted patents·5 pending applications·166 citations·filing 1999–2025
84Inventor score
Files withHENKEL AG & CO KGAA6Henkel IP & Holding GmbH6FERRO CORP1HENKEL CORP1NAT STARCH CHEM INVEST1
Top patents by PatentIndex Score
16 records- 0193US6162849AThermally conductive thermoplasticFERRO CORP·Filed 1999·Granted Dec 19, 2000·152 cites·14 claims
- 0284US7422707B2Highly conductive composition for wafer coatingNAT STARCH CHEM INVEST·Filed 2007·Granted Sep 9, 2008·13 cites·6 claims
- 0372US2024174854A1Resin composition for non-conductive film with excellent high temperature properties for 3d tsv packagesHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0470US12042883B2Sinterable films and pastes and methods for use thereofHENKEL AG & CO KGAA·Filed 2023·Granted Jul 23, 2024·0 cites·13 claims
- 0570US11745294B2Sinterable films and pastes and methods for use thereofHENKEL AG & CO KGAA·Filed 2017·Granted Sep 5, 2023·1 cites·7 claims
- 0668US2024076488A1Electrically conductive compositions capable of sinteringHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0760US2025206921A1Resin composition for die attach film with excellent performance with large die applicationsHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 0859US2024209166A1Resin composition for non-conductive film with excellent high temperature properties for 3d tsv packagesHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0957US8759422B2B-stageable and skip-curable wafer back side coating adhesivesHENKEL CORP·Filed 2013·Granted Jun 24, 2014·0 cites·10 claims
- 1056US11304346B2Method for shielding system-in-package assemblies from electromagnetic interferenceHenkel IP & Holding GmbH·Filed 2020·Granted Apr 12, 2022·0 cites·1 claims
- 1154US10834858B2Method for shielding system-in-package assemblies from electromagnetic interferenceHenkel IP & Holding GmbH·Filed 2019·Granted Nov 10, 2020·0 cites·16 claims
- 1246US2008166543A1Highly conductive composition for wafer coatingZHUO QIZHUO·Filed 2007·Application pending·0 cites
- 1342US10985108B2Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereofHenkel IP & Holding GmbH·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 1442US10741503B2Graphene-containing materials for coating and gap filling applicationsHenkel IP & Holding GmbH·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 1540US9230888B2Wafer back side coating as dicing tape adhesiveHenkel IP & Holding GmbH·Filed 2013·Granted Jan 5, 2016·0 cites·5 claims
- 1628US10858523B2Achieving electromagnetic interference shielding protection by deposition of highly conductive compositionsHenkel IP & Holding GmbH·Filed 2018·Granted Dec 8, 2020·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →