Inventor · disambiguated record
Quinn K. Tong
Also filed as: TONG QUINN · TONG QUINN K · TONG QUINN KUN
18 granted patents·2 pending applications·507 citations·filing 1995–2005
96Inventor score
Top patents by PatentIndex Score
20 records- 0188US6344157B1Conductive and resistive materials with electrical stability for use in electronics devicesNAT STARCH CHEM INVEST·Filed 2001·Granted Feb 5, 2002·52 cites·20 claims
- 0288US5685758AHot melt adhesive compositions with improved wicking propertiesNAT STARCH CHEM INVEST·Filed 1996·Granted Nov 11, 1997·69 cites·5 claims
- 0384US6281314B1Compositions for use in the fabrication of circuit components and printed wire boardsNAT STARCH CHEM INVEST·Filed 1999·Granted Aug 28, 2001·46 cites·7 claims
- 0481US7608487B2B-stageable underfill encapsulant and method for its applicationHENKEL AG & CO KGAA·Filed 2005·Granted Oct 27, 2009·11 cites·6 claims
- 0580US6063828AUnderfill encapsulant compositions for use in electronic devicesNAT STARCH CHEM INVEST·Filed 1998·Granted May 16, 2000·65 cites·33 claims
- 0680US6057381AMethod of making an electronic component using reworkable underfill encapsulantsNAT STARCH CHEM INVEST·Filed 1998·Granted May 2, 2000·53 cites·32 claims
- 0779US6316566B1Package encapsulant compositions for use in electronic devicesNAT STARCH CHEM INVEST·Filed 1999·Granted Nov 13, 2001·31 cites·2 claims
- 0873US6833629B2Dual cure B-stageable underfill for wafer levelNAT STARCH CHEM INVEST·Filed 2001·Granted Dec 21, 2004·24 cites·2 claims
- 0971US5807959AFlexible epoxy adhesives with low bleeding tendencyNAT STARCH CHEM INVEST·Filed 1997·Granted Sep 15, 1998·41 cites·4 claims
- 1066US5770706ASnap-cure epoxy adhesivesNAT STARCH CHEM INVEST·Filed 1996·Granted Jun 23, 1998·28 cites·24 claims
- 1163US7037399B2Underfill encapsulant for wafer packaging and method for its applicationNAT STARCH CHEM INVEST·Filed 2002·Granted May 2, 2006·13 cites·24 claims
- 1259US5620683AAqueous, acrylic hair fixatives and methods of making sameNAT STARCH CHEM INVEST·Filed 1995·Granted Apr 15, 1997·21 cites·14 claims
- 1358US5686062AAcrylic hair fixatives and methods of making sameNAT STARCH CHEM INVEST·Filed 1995·Granted Nov 11, 1997·20 cites·72 claims
- 1457US7004375B2Pre-applied fluxing underfill composition having pressure sensitive adhesive propertiesNAT STARCH CHEM INVEST·Filed 2003·Granted Feb 28, 2006·9 cites·12 claims
- 1549US6350838B2Package encapsulant compositions for use in electronic devicesNAT STARCH CHEM INVEST·Filed 2001·Granted Feb 26, 2002·1 cites·27 claims
- 1649US6180187B1Method of making an electronic component using reworkable underfill encapsulantsNAT STARCH CHEM INVEST·Filed 1999·Granted Jan 30, 2001·14 cites·17 claims
- 1739US5856383ASnap-cure epoxy adhesivesNAT STARCH CHEM INVEST·Filed 1998·Granted Jan 5, 1999·7 cites·9 claims
- 1834US2003164555A1B-stageable underfill encapsulant and method for its applicationFiled 2002·Application pending·0 cites
- 1934US2003162911A1No flow underfill compositionFiled 2002·Application pending·0 cites
- 2031US5854315ASnap-cure epoxy adhesivesNAT STARCH CHEM INVEST·Filed 1997·Granted Dec 29, 1998·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →