Inventor · disambiguated record

Quat T. Yu

Also filed as: YU QUAT T

1 granted patent·70 citations·filing 1996–1996

52Inventor score

Technology areasH10W

Files withINTEL CORP1

Top patents by PatentIndex Score

1 record

0182US5863832ACapping layer in interconnect system and method for bonding the capping layer onto the interconnect systemINTEL CORP·Filed 1996·Granted Jan 26, 1999·70 cites·12 claims

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