Inventor · disambiguated record
Ravikumar Adimula
Also filed as: ADIMULA RAVIKUMAR
2 granted patents·1 pending application·0 citations·filing 2008–2009
22Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0139US8344491B2Multi-die building block for stacked-die packageMICRON TECHNOLOGY INC·Filed 2008·Granted Jan 1, 2013·0 cites·21 claims
- 0235US2010167466A1Semiconductor package substrate with metal bumpsADIMULA RAVIKUMAR·Filed 2008·Application pending·0 cites
- 0331US8653675B2Package including at least one topological feature on an encapsulant material to resist out-of-plane deformationZHANG JAMES JIAN·Filed 2009·Granted Feb 18, 2014·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →