Inventor · disambiguated record
Ranjul Balakrishnan
Also filed as: BALAKRISHNAN RANJUL
11 granted patents·8 pending applications·4 citations·filing 2016–2023
80Inventor score
Top patents by PatentIndex Score
19 records- 0177US12349274B2Low profile SODIMM (small outline dual inline memory module)INTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·22 claims
- 0277US10177161B2Methods of forming package structures for enhanced memory capacity and structures formed therebyINTEL CORP·Filed 2016·Granted Jan 8, 2019·3 cites·17 claims
- 0365US11363717B2Inductor array and supportINTEL CORP·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 0461US12336088B2Inductive coupling structures for reducing cross talk effects in parallel bus technologiesINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·24 claims
- 0558US12426153B2Twisted differential compensation for routing high-speed signals near power delivery inductors and system miniaturizationINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 0655US2022223330A1Technologies for a low-noise-generating inductorWANG LONG·Filed 2022·Application pending·0 cites
- 0755US2025112125A1Bridges over metal voids in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0853US2024413066A1Embedded semiconductor deviceINTEL CORP·Filed 2023·Application pending·0 cites
- 0951US10734393B2Methods of forming package structures for enhanced memory capacity and structures formed therebyINTEL CORP·Filed 2018·Granted Aug 4, 2020·0 cites·9 claims
- 1051US10720407B2Microelectronic interposer for a microelectronic packageINTEL CORP·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 1151US2023317680A1Ribbon shield device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 1248US2023006375A1Connector-less m.2 moduleINTEL CORP·Filed 2022·Application pending·0 cites
- 1346US10199353B2Microelectronic interposer for a microelectronic packageINTEL CORP·Filed 2016·Granted Feb 5, 2019·0 cites·29 claims
- 1446US2025105830A1Pattern-aware enhanced crosstalk cancellation (pextc) schemeBALAKRISHNAN RANJUL·Filed 2023·Application pending·0 cites
- 1542US10608311B2Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portionINTEL CORP·Filed 2017·Granted Mar 31, 2020·0 cites·22 claims
- 1642US2020373081A1Inductor with metal shieldINTEL CORP·Filed 2020·Application pending·0 cites
- 1739US12484160B2Technologies for shielding an inductor on a circuit boardINTEL CORP·Filed 2021·Granted Nov 25, 2025·0 cites·13 claims
- 1837US2019206839A1Electronic device packageINTEL CORP·Filed 2017·Application pending·0 cites
- 1932US11600544B2Chip package with staggered pin patternINTEL CORP·Filed 2019·Granted Mar 7, 2023·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →