Inventor · disambiguated record
Raymond F. Bis
Also filed as: BIS RAYMOND · BIS RAYMOND F
1 granted patent·3 pending applications·2 citations·filing 2009–2023
18Inventor score
Top patents by PatentIndex Score
4 records- 0181US10815405B2One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2017·Granted Oct 27, 2020·2 cites·11 claims
- 0257US2025382510A1Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0353US2025368868A1Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0447US2010028651A1Toughened expandable epoxy resins for stiffening and energy dissipation in automotive cavitiesGOLDEN MICHAEL R·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →