Inventor · disambiguated record
Randle D. Burton
Also filed as: BURTON RANDLE D
8 granted patents·130 citations·filing 1997–2002
88Inventor score
Files withMICRON TECHNOLOGY INC8
Top patents by PatentIndex Score
8 records- 0181US6121134AHigh aspect ratio metallization structures and processes for fabricating the sameMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 19, 2000·39 cites·19 claims
- 0268US6168696B1Non-knurled induction coil for ionized metal deposition, sputtering apparatus including same, and method of constructing the apparatusMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 2, 2001·35 cites·30 claims
- 0365US6495921B1High aspect ratio metallization structuresMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 17, 2002·9 cites·10 claims
- 0458US6690094B2High aspect ratio metallization structuresMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 10, 2004·6 cites·16 claims
- 0553US6316360B1High aspect ratio metallization structures for shallow junction devices, and methods of forming the sameMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 13, 2001·16 cites·17 claims
- 0651US6057235AMethod for reducing surface charge on semiconducter wafers to prevent arcing during plasma depositionMICRON TECHNOLOGY INC·Filed 1997·Granted May 2, 2000·14 cites·17 claims
- 0746US6258718B1Method for reducing surface charge on semiconductor wafers to prevent arcing during plasma depositionMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 10, 2001·1 cites·20 claims
- 0845US6320261B1High aspect ratio metallization structures for shallow junction devices, and methods of forming the sameMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 20, 2001·10 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →