Inventor · disambiguated record
Ravi Chandran
Also filed as: CHANDRAN RAVI · CHANDRAN RAVI R
6 granted patents·5 pending applications·99 citations·filing 2001–2010
83Inventor score
Top patents by PatentIndex Score
11 records- 0193US6599643B2Energy enhanced process for treating a conductive surface and products formed therebyELISHA HOLDING LLC·Filed 2001·Granted Jul 29, 2003·52 cites·10 claims
- 0284US6592738B2Electrolytic process for treating a conductive surface and products formed therebyELISHA HOLDING LLC·Filed 2001·Granted Jul 15, 2003·16 cites·26 claims
- 0382US6911139B2Process for treating a conductive surface and products formed therebyELISHA HOLDING LLC·Filed 2002·Granted Jun 28, 2005·17 cites·19 claims
- 0473US6994779B2Energy enhanced process for treating a conductive surface and products formed therebyELISHA HOLDING LLC·Filed 2003·Granted Feb 7, 2006·10 cites·22 claims
- 0559US6866896B2Method for treating metallic surfaces and products formed therebyELISHA HOLDING LLC·Filed 2003·Granted Mar 15, 2005·4 cites·31 claims
- 0657US2010326822A1Multilayer electrochemical cell technology using sol-gel processing applied to ceramic oxygen generatorCHANDRAN RAVI R·Filed 2010·Application pending·0 cites
- 0755US7790221B2Sol-gel fabrication of thin-film electrolyte in an oxygen generatorUNIV RUTGERS·Filed 2005·Granted Sep 7, 2010·0 cites·5 claims
- 0846US2005194262A1Process for treating a conductive surface and products formed therebyELISHA HOLDING LLC·Filed 2005·Application pending·0 cites
- 0945US2003164311A1Multilayer electrochemical cell technology using sol-gel processing applied to ceramic oxygen generatorFiled 2003·Application pending·0 cites
- 1042US2004188262A1Method for treating metallic surfaces and products formed therebyFiled 2004·Application pending·0 cites
- 1140US2004222105A1Method for preparing and using silicate systems to treat electrically conductive surfaces and products obtained therefromFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →