Inventor · disambiguated record
Raghunandan Chaware
Also filed as: CHAWARE RAGHUNANDAN · CHAWARE RAGHUNANDAN R
22 granted patents·5 pending applications·303 citations·filing 2005–2019
95Inventor score
Top patents by PatentIndex Score
27 records- 0197US9865567B1Heterogeneous integration of integrated circuit device and companion deviceXILINX INC·Filed 2017·Granted Jan 9, 2018·33 cites·16 claims
- 0297US9418909B1Stacked silicon package assembly having enhanced lid adhesionXILINX INC·Filed 2015·Granted Aug 16, 2016·28 cites·19 claims
- 0397US8704384B2Stacked die assemblyWU EPHREM C·Filed 2012·Granted Apr 22, 2014·71 cites·20 claims
- 0495US10602612B1Vertical module and perpendicular pin array interconnect for stacked circuit board structureAPPLE INC·Filed 2019·Granted Mar 24, 2020·17 cites·16 claims
- 0594US8415783B1Apparatus and methodology for testing stacked dieRAHMAN ARIFUR·Filed 2007·Granted Apr 9, 2013·33 cites·18 claims
- 0692US7863092B1Low cost bumping and bonding method for stacked dieXILINX INC·Filed 2008·Granted Jan 4, 2011·26 cites·19 claims
- 0791US10840192B1Stacked silicon package assembly having enhanced stiffenerXILINX INC·Filed 2017·Granted Nov 17, 2020·12 cites·21 claims
- 0890US7906857B1Molded integrated circuit package and method of forming a molded integrated circuit packageXILINX INC·Filed 2008·Granted Mar 15, 2011·30 cites·18 claims
- 0984US9989572B1Method and apparatus for testing interposer dies prior to assemblyXILINX INC·Filed 2014·Granted Jun 5, 2018·5 cites·16 claims
- 1084US8841752B1Semiconductor structure and method for interconnection of integrated circuitsCHAWARE RAGHUNANDAN·Filed 2011·Granted Sep 23, 2014·9 cites·11 claims
- 1182US9385106B1Method for providing charge protection to one or more dies during formation of a stacked silicon deviceXILINX INC·Filed 2014·Granted Jul 5, 2016·5 cites·21 claims
- 1282US8766086B2System and method for laminating photovoltaic structuresMAHESHWARI ABHAY·Filed 2010·Granted Jul 1, 2014·5 cites·10 claims
- 1382US8519528B1Semiconductor structure and method for interconnection of integrated circuitsNAGARAJAN KUMAR·Filed 2011·Granted Aug 27, 2013·7 cites·12 claims
- 1479US10032682B1Multi-die wafer-level test and assembly without comprehensive individual die singulationXILINX INC·Filed 2016·Granted Jul 24, 2018·3 cites·19 claims
- 1578US9761533B2Interposer-less stack die interconnectXILINX INC·Filed 2015·Granted Sep 12, 2017·3 cites·20 claims
- 1678US7338842B2Process for exposing solder bumps on an underfill coated semiconductorNAT STARCH CHEM INVEST·Filed 2005·Granted Mar 4, 2008·9 cites·14 claims
- 1771US8900987B1Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devicesXILINX INC·Filed 2013·Granted Dec 2, 2014·3 cites·19 claims
- 1870US10638608B2Interconnect frames for SIP modulesAPPLE INC·Filed 2018·Granted Apr 28, 2020·1 cites·18 claims
- 1968US2014312530A1System and method for laminating photovoltaic structuresSOLARIA CORP·Filed 2014·Application pending·0 cites
- 2066US11075117B2Die singulation and stacked device structuresXILINX INC·Filed 2018·Granted Jul 27, 2021·1 cites·20 claims
- 2165US10204841B1Temporary connection traces for wafer sort testingXILINX INC·Filed 2016·Granted Feb 12, 2019·1 cites·19 claims
- 2260US9341668B1Integrated circuit package testingXILINX INC·Filed 2014·Granted May 17, 2016·1 cites·18 claims
- 2356US2013206208A1System and method for determining placement of photovoltaic strips using displacement sensorsSOLARIA CORP·Filed 2012·Application pending·0 cites
- 2451US8361259B2System and method for determining placement of photovoltaic strips using displacement sensorsSOLARIA CORP·Filed 2010·Granted Jan 29, 2013·0 cites·10 claims
- 2544US2012211052A1Photovoltaic strip solar modules and methodsMARATHE AJAY·Filed 2012·Application pending·0 cites
- 2640US2012167948A1System and method for forming photovoltaic modulesMARATHE AJAY·Filed 2010·Application pending·0 cites
- 2737US2006134901A1Hot-Melt Underfill Composition and Methos of ApplicationNAT STARCH CHEM INVEST·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →