Inventor · disambiguated record
Ray Fredric De Asis
Also filed as: DE ASIS RAY FREDRIC · DE ASIS RAY FREDRIC SOLIS
4 granted patents·11 pending applications·0 citations·filing 2019–2024
57Inventor score
Files withTEXAS INSTRUMENTS INC15
Top patents by PatentIndex Score
15 records- 0173US12512381B2Plated walls defining mold compound cavitiesTEXAS INSTRUMENTS INC·Filed 2024·Granted Dec 30, 2025·0 cites·19 claims
- 0262US11942387B2Plated walls defining mold compound cavitiesTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·15 claims
- 0359US11600583B2Textured bond padsTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 7, 2023·0 cites·30 claims
- 0453US2025279323A1Sensor packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0551US11081456B2Textured bond padsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·30 claims
- 0651US2025246563A1Partially pulse-plated bond padsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0751US2025273547A1Stitch bond to copper nanotwin plated leadTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0850US2025140735A1Direct copper wire bonding on nanotwin copper structuresTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0949US2025006683A1Bump landing with bond wires for improved solder wettingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1049US2025079388A1Integrated circuit having improved ball bonding adhesionTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1148US2024203801A1Test pad on device lead for test contactorTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1248US2024322786A1Bulk Acoustic Wave (BAW) Microresonator PackageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1347US2025201738A1Die with bond padTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1447US2023411265A1Split semiconductor packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1541US2024128228A1Security wire over stitch bondTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →