Inventor · disambiguated record
Ranadeep Dutta
Also filed as: DUTTA RANADEEP
38 granted patents·28 pending applications·80 citations·filing 1997–2025
95Inventor score
Top patents by PatentIndex Score
66 records- 0191US11984874B2Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted May 14, 2024·2 cites·33 claims
- 0288US11336251B2Device with 3D inductor and magnetic core in substrateQUALCOMM INC·Filed 2020·Granted May 17, 2022·2 cites·29 claims
- 0387US12046530B2Thermal bridge interposer structureQUALCOMM INC·Filed 2021·Granted Jul 23, 2024·1 cites·28 claims
- 0485US11355617B2Self-aligned collector heterojunction bipolar transistor (HBT)QUALCOMM INC·Filed 2019·Granted Jun 7, 2022·4 cites·14 claims
- 0582US10546852B2Integrated semiconductor devices and method of fabricating the sameQUALCOMM INC·Filed 2018·Granted Jan 28, 2020·3 cites·23 claims
- 0679US9153691B1High voltage MOS transistorQUALCOMM INC·Filed 2014·Granted Oct 6, 2015·5 cites·28 claims
- 0778US12334903B2Substrate comprising acoustic resonators configured as at least one acoustic filterQUALCOMM INC·Filed 2020·Granted Jun 17, 2025·1 cites·19 claims
- 0876US11393789B2Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bondingQUALCOMM INC·Filed 2019·Granted Jul 19, 2022·2 cites·30 claims
- 0976US9252147B2Methods and apparatuses for forming multiple radio frequency (RF) components associated with different RF bands on a chipQUALCOMM INC·Filed 2013·Granted Feb 2, 2016·3 cites·25 claims
- 1075US10340289B2Cascode radio frequency (RF) power amplifier on single diffusionQUALCOMM INC·Filed 2017·Granted Jul 2, 2019·3 cites·28 claims
- 1172US6627961B1Hybrid IGBT and MOSFET for zero current at zero voltageINT RECTIFIER CORP·Filed 2000·Granted Sep 30, 2003·18 cites·6 claims
- 1269US6441455B1Low dosage field rings for high voltage semiconductor deviceINT RECTIFIER CORP·Filed 1997·Granted Aug 27, 2002·31 cites·14 claims
- 1369US2025210852A1Antenna modules employing three-dimensional (3d) build-up on mold package to support efficient integration of radio-frequency (rf) circuitry, and related fabrication methodsQUALCOMM INC·Filed 2025·Application pending·0 cites
- 1468US10158030B2CMOS and bipolar device integration including a tunable capacitorQUALCOMM INC·Filed 2017·Granted Dec 18, 2018·1 cites·20 claims
- 1567US12255381B2Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methodsQUALCOMM INC·Filed 2022·Granted Mar 18, 2025·0 cites·23 claims
- 1663US12512593B2Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methodsQUALCOMM INC·Filed 2023·Granted Dec 30, 2025·0 cites·38 claims
- 1762US2025370196A1Device comprising an opto-electronic integrated device and stacked integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1861US11626236B2Stacked inductor having a discrete metal-stack patternQUALCOMM INC·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 1961US2025338525A1Impure indium phosphide semiconductor substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2061US2025293204A1Integrated circuit device including a multi-chip packageQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2160US2025226365A1Integrated circuit device including impedance adapterQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2260US2025201662A1Integrated circuit device including thermal interposer layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2360US2025216623A1Interposer having integrated optical waveguideQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2459US11394360B2Resonator deviceQUALCOMM INC·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 2559US2025096116A1Inductor performance enhancement using an outer, peripheral patterned ground shieldQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2659US2025096093A1Integrated devices coupled to interposer comprising porous portionQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2759US2025096090A1Integrated device comprising silicon substrate with porous portionQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2858US12401326B2Reducing parasitic capacitanceQUALCOMM INC·Filed 2022·Granted Aug 26, 2025·0 cites·23 claims
- 2958US12283607B23D inductor design using bundle substrate viasQUALCOMM INC·Filed 2021·Granted Apr 22, 2025·0 cites·10 claims
- 3058US11380678B2Metamorphic high electron mobility transistor-heterojunction bipolar transistor integrationQUALCOMM INC·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 3158US2025247076A1Integrated devices with multiple acoustic resonator chipletsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3257US2024421790A1DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERCONNECTION, AND RELATED FABRICATION METHODSQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3356US12424518B2Capacitor embedded 3D resonator for broadband filterQUALCOMM INC·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 3456US11791226B2Device on ceramic substrateQUALCOMM INC·Filed 2020·Granted Oct 17, 2023·0 cites·25 claims
- 3556US11404345B2Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) pathQUALCOMM INC·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 3656US2025047262A1Acoustic devices with integrated circuit elements and related fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3756US2024243036A1Cavity-embedded tunable filterQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3855US2024096817A1On-chip hybrid electromagnetic interference (emi) shielding with thermal mitigationQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3954US11437367B2Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filterQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·16 claims
- 4054US11152272B2Die-to-wafer hybrid bonding with forming glassQUALCOMM INC·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 4154US2024021353A1Three-dimensional vertical co-spiral inductorsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 4253US11862367B2ESL-less AC resistor for high frequency applicationsQUALCOMM INC·Filed 2021·Granted Jan 2, 2024·0 cites·27 claims
- 4351US11749746B2Radio frequency front end (RFFE) hetero-integrationQUALCOMM INC·Filed 2021·Granted Sep 5, 2023·0 cites·26 claims
- 4451US2023092429A1High density silicon based capacitorQUALCOMM INC·Filed 2021·Application pending·0 cites
- 4551US2023088569A1Radio-frequency integrated circuits (rfics) including a porosified semiconductor isolation region to reduce noise interference and related fabrication methodsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 4650US10950721B2Self-aligned high voltage transistorQUALCOMM INC·Filed 2019·Granted Mar 16, 2021·0 cites·19 claims
- 4750US7005702B1IGBT with amorphous silicon transparent collectorINT RECTIFIER CORP·Filed 2000·Granted Feb 28, 2006·4 cites·13 claims
- 4849US11605620B2Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bondingQUALCOMM INC·Filed 2020·Granted Mar 14, 2023·0 cites·20 claims
- 4949US10707352B2Transistor with lightly doped drain (LDD) compensation implantQUALCOMM INC·Filed 2018·Granted Jul 7, 2020·0 cites·19 claims
- 5049US2022302107A1Compound semiconductor and complementary metal oxide semiconductor (cmos) transistor integrationQUALCOMM INC·Filed 2021·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →