Inventor · disambiguated record
Randolph Estal Flauta
Also filed as: FLAUTA RANDOLPH E · FLAUTA RANDOLPH ESTAL
1 granted patent·9 pending applications·34 citations·filing 2009–2025
45Inventor score
Top patents by PatentIndex Score
10 records- 0187US8486843B2Method of forming nanoscale three-dimensional patterns in a porous materialLI XIULING·Filed 2009·Granted Jul 16, 2013·34 cites·21 claims
- 0259US2025174526A1Semiconductor packageNexperia BV·Filed 2024·Application pending·0 cites
- 0356US2025006597A1Semiconductor device as well as a method for manufacturing such semiconductor deviceNexperia BV·Filed 2024·Application pending·0 cites
- 0452US2025385190A1Package comprising a first and a second semiconductor die, wherein a galvanic coupling is provided between those semiconductor dies, as well as a corresponding methodNexperia BV·Filed 2025·Application pending·0 cites
- 0552US2025385194A1Leadless package comprising a first and a second semiconductor die, wherein a galvanic isolation is provided between those semiconductor dies, as well as a corresponding methodNexperia BV·Filed 2025·Application pending·0 cites
- 0652US2025385188A1Leadless package comprising a first and a second semiconductor die, wherein a galvanic coupling is provided between those semiconductor dies, as well as a corresponding methodNexperia BV·Filed 2025·Application pending·0 cites
- 0752US2024105514A1Method of singulation of dies from a waferNexperia BV·Filed 2023·Application pending·0 cites
- 0852US2025385193A1A leadless package comprising a first and a second semiconductor die, wherein a galvanic coupling is provided between those semiconductor dies, as well as a corresponding methodNexperia BV·Filed 2025·Application pending·0 cites
- 0950US2023178507A1Step interconnect metallization to enable panel level packagingNexperia BV·Filed 2022·Application pending·0 cites
- 1046US2023137612A1Semiconductor package assembly and method of manufacturingNexperia BV·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →