Inventor · disambiguated record
Rafael Jose Lizares Guevara
Also filed as: GUEVARA III RAFAEL JOSE LIZARES · GUEVARA RAFAEL JOSE · GUEVARA RAFAEL JOSE L · GUEVARA RAFAEL JOSE LIZARES
20 granted patents·15 pending applications·9 citations·filing 2017–2025
89Inventor score
Files withTEXAS INSTRUMENTS INC35
Top patents by PatentIndex Score
35 records- 0187US11699639B2Conductive member cavitiesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 11, 2023·2 cites·26 claims
- 0286US11862576B2IC having electrically isolated warpage prevention structuresTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 0380US2025289711A1Semiconductor package with metal column mold barrierTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0479US11637083B2Flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 25, 2023·1 cites·18 claims
- 0579US10593640B2Flip chip integrated circuit packages with spacersTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 17, 2020·3 cites·21 claims
- 0673US11239190B2Solder-metal-solder stack for electronic interconnectTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 1, 2022·1 cites·18 claims
- 0773US2024413114A1Conductive members for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0872US12205871B2Conductive member cavitiesTEXAS INSTRUMENTS INC·Filed 2023·Granted Jan 21, 2025·0 cites·22 claims
- 0971US12319563B2Semiconductor package with metal column mold barrierTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 3, 2025·0 cites·15 claims
- 1071US2025015032A1Semiconductor device with solder on pillarTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1170US12266631B2Flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 1, 2025·0 cites·15 claims
- 1268US2025218991A1Flip chip package assembly having post connects with solder-based jointsTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1366US12288763B2Flip chip package assembly having post connects with solder-based jointsTEXAS INSTRUMENTS INC·Filed 2022·Granted Apr 29, 2025·0 cites·15 claims
- 1466US12107062B2Semiconductor device with solder on pillarTEXAS INSTRUMENTS INC·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 1566US2024153903A1Flip chip package assemblyTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1665US2024413113A1Conductive terminal for side facing packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1763US11876065B2Flip chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 16, 2024·0 cites·17 claims
- 1861US12080667B2Conductive terminal for side facing packagesTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 3, 2024·0 cites·19 claims
- 1960US12266624B2Semiconductor die with solder restraining wallTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 1, 2025·0 cites·22 claims
- 2059US11600583B2Textured bond padsTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 7, 2023·0 cites·30 claims
- 2159US2025246564A1Package conductive terminals with reduced palladium volumesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2257US12009272B2Integral redistribution layer for WCSPTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 11, 2024·0 cites·24 claims
- 2355US2025105195A1Electronic component package having a metal plate structure that includes a tapered foot portionTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2454US12100678B2Conductive members for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 24, 2024·0 cites·33 claims
- 2554US11929308B2Flip chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·24 claims
- 2654US2024234356A1Conductive member with metal core for substrate connectionsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2752US2024203919A1Integrated circuit having exposed leadsTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2851US11081456B2Textured bond padsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·30 claims
- 2947US11145612B2Methods for bump planarity controlTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 12, 2021·0 cites·17 claims
- 3047US2024258251A1Polyimide layer depressions between metal pillarsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3147US2023129699A1Ic package with interface regionTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3246US11864471B2Semiconductor device with passivated magnetic concentratorTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·0 cites·22 claims
- 3346US2024038608A1Semiconductor packages with cavities and methods of making thereofTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3442US2023137996A1Conductive members with unobstructed interfacial area for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3542US2023317662A1Electronic device with sensor face stress protectionTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →