Inventor · disambiguated record
Ran Jing
Also filed as: JING RAN
1 granted patent·2 pending applications·0 citations·filing 2019–2024
4Inventor score
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3 records- 0162US2024295013A1High-entropy alloy (hea) with room-temperature superplasticity and preparation method thereofUNIV SHAANXI TECHNOLOGY·Filed 2024·Application pending·0 cites
- 0261US2025092494A1High-plasticity dual-phase high-entropy alloy and preparation method thereofUNIV SHAANXI TECHNOLOGY·Filed 2023·Application pending·0 cites
- 0344US10939230B2Interaction information obtaining method, interaction information setting method, user terminal, system, and storage mediumTENCENT TECH SHENZHEN CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →