Inventor · disambiguated record
Rakhwan Kim
Also filed as: KIM RAKHWAN
17 granted patents·6 pending applications·6 citations·filing 2019–2024
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD23
Top patents by PatentIndex Score
23 records- 0193US11270944B2Semiconductor device having interconnection lines with different linewidths and metal patternsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 8, 2022·3 cites·20 claims
- 0287US11967554B2Semiconductor devices and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 23, 2024·1 cites·15 claims
- 0384US12176290B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 24, 2024·2 cites·20 claims
- 0469US12199038B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 0567US12176287B2Integrated circuit devices having improved contact plug structures thereinSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 24, 2024·0 cites·20 claims
- 0664US12444675B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0763US12199042B2Semiconductor device having interconnection lines with different linewidths and metal patternsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·14 claims
- 0863US11990473B2Integrated circuits and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·17 claims
- 0963US11728268B2Semiconductor devices including via structures having a via portion and a barrier portionSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1060US2025118669A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1160US2025374600A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1259US11587867B2Semiconductor devices and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·10 claims
- 1357US11908798B2Integrated circuit devices having improved contact plug structures thereinSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 1456US11335680B2Integrated circuits and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·0 cites·18 claims
- 1554US12354943B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 1654US12243815B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 1753US12080797B2Multi-bridge channel field effect transistor with recessed source/drainSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 1852US12347768B2Semiconductor device including via structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·22 claims
- 1948US2024145387A1Semiconductor device including a contact plugSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2048US2024178061A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2148US2024170546A1Semiconductor devices having contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2247US2024339395A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2341US12513972B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 30, 2025·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →