Inventor · disambiguated record
Rangsun Kitnarong
Also filed as: KITNARONG RANGSUN
4 granted patents·6 pending applications·16 citations·filing 2008–2021
63Inventor score
Files withMICROCHIP TECH INC10
Top patents by PatentIndex Score
10 records- 0184US10211131B1Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor deviceMICROCHIP TECH INC·Filed 2017·Granted Feb 19, 2019·16 cites·33 claims
- 0247US11127660B2Surface-mount integrated circuit package with coated surfaces for improved solder connectionMICROCHIP TECH INC·Filed 2019·Granted Sep 21, 2021·0 cites·16 claims
- 0347US11101200B2Surface-mount integrated circuit package with coated surfaces for improved solder connectionMICROCHIP TECH INC·Filed 2019·Granted Aug 24, 2021·0 cites·16 claims
- 0443US2008265923A1Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the LikeMICROCHIP TECH INC·Filed 2008·Application pending·0 cites
- 0539US2017005030A1Flat No-Leads Package With Improved Contact PinsMICROCHIP TECH INC·Filed 2016·Application pending·0 cites
- 0637US2016148876A1Flat no-leads package with improved contact pinsMICROCHIP TECH INC·Filed 2015·Application pending·0 cites
- 0736US11887864B2Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminalsMICROCHIP TECH INC·Filed 2021·Granted Jan 30, 2024·0 cites·21 claims
- 0830US2019221502A1Down Bond in Semiconductor DevicesMICROCHIP TECH INC·Filed 2018·Application pending·0 cites
- 0928US2016148877A1Qfn package with improved contact pinsMICROCHIP TECH INC·Filed 2015·Application pending·0 cites
- 1028US2017294367A1Flat No-Leads Package With Improved Contact PinsMICROCHIP TECH INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →