Inventor · disambiguated record
Ray T. Ko
Also filed as: KO RAY T
3 granted patents·7 citations·filing 2018–2018
60Inventor score
Technology areasG01N
Files withUS GOV AIR FORCE3
Top patents by PatentIndex Score
3 records- 0190US10458958B1Ultrasonic through-thickness modulus evaluation of materialsUS GOV AIR FORCE·Filed 2018·Granted Oct 29, 2019·6 cites·10 claims
- 0277US10620167B1In-plane modulus testing of materials by an ultrasonic dry-contact methodUS GOV AIR FORCE·Filed 2018·Granted Apr 14, 2020·1 cites·11 claims
- 0363US10620166B1In-plane modulus testing of materials by an ultrasonic same-side methodUS GOV AIR FORCE·Filed 2018·Granted Apr 14, 2020·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →