Inventor · disambiguated record
Randy H. Y. Lo
Also filed as: LO RANDY H Y
24 granted patents·1,410 citations·filing 1999–2003
97Inventor score
Technology areasH10W
Top patents by PatentIndex Score
24 records- 0198US6507120B2Flip chip type quad flat non-leaded packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jan 14, 2003·241 cites·21 claims
- 0297US6593662B1Stacked-die package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 15, 2003·203 cites·26 claims
- 0397US6282094B1Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·182 cites·23 claims
- 0494US6650009B2Structure of a multi chip module having stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Nov 18, 2003·102 cites·18 claims
- 0594US6555902B2Multiple stacked-chip packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 29, 2003·91 cites·15 claims
- 0693US6541310B1Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Apr 1, 2003·61 cites·8 claims
- 0790US6507098B1Multi-chip packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jan 14, 2003·121 cites·11 claims
- 0890US6282096B1Integration of heat conducting apparatus and chip carrier in IC packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·60 cites·17 claims
- 0988US6611434B1Stacked multi-chip package structure with on-chip integration of passive componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 26, 2003·52 cites·8 claims
- 1085US6281578B1Multi-chip module package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·42 cites·9 claims
- 1180US6951776B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Oct 4, 2005·19 cites·8 claims
- 1277US6528722B2Ball grid array semiconductor package with exposed base layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Mar 4, 2003·52 cites·2 claims
- 1377US6306682B1Method of fabricating a ball grid array integrated circuit package having an encapsulating bodySILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Oct 23, 2001·26 cites·14 claims
- 1477US6258705B1Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chipSILICONEWARE PREC IND CO LTD·Filed 2000·Granted Jul 10, 2001·27 cites·4 claims
- 1574US6949413B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Sep 27, 2005·13 cites·8 claims
- 1673US7045395B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted May 16, 2006·12 cites·9 claims
- 1773US6933175B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Aug 23, 2005·12 cites·8 claims
- 1872US6242283B1Wafer level packaging process of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jun 5, 2001·41 cites·20 claims
- 1969US6753609B2Circuit probing contact pad formed on a bond pad in a flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 22, 2004·13 cites·3 claims
- 2064US6949414B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Sep 27, 2005·7 cites·8 claims
- 2160US6798054B1Method of packaging multi chip moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 28, 2004·12 cites·15 claims
- 2256US6391758B1Method of forming solder areas over a lead frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 21, 2002·7 cites·5 claims
- 2355US6321976B1Method of wire bonding for small clearanceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Nov 27, 2001·8 cites·8 claims
- 2449US6864564B2Flash-preventing semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Mar 8, 2005·6 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →