Inventor · disambiguated record

Raymond Albert Narvadez

Also filed as: NARVADEZ RAYMOND ALBERT

3 granted patents·1 pending application·1 citations·filing 2017–2021

52Inventor score

Technology areasH10W

Files withST MICROELECTRONICS INC4

Top patents by PatentIndex Score

4 records

0166US10796984B2Leadframe having a conductive layer protruding through a lead recessST MICROELECTRONICS INC·Filed 2019·Granted Oct 6, 2020·1 cites·21 claims
0264US11688715B2Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frameST MICROELECTRONICS INC·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
0356US11152326B2Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frameST MICROELECTRONICS INC·Filed 2019·Granted Oct 19, 2021·0 cites·21 claims
0442US2018190575A1Leadframe with lead protruding from the packageST MICROELECTRONICS INC·Filed 2017·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →