Inventor · disambiguated record
Raj Peddi
Also filed as: PEDDI RAJ
3 granted patents·2 pending applications·3 citations·filing 2012–2014
55Inventor score
Top patents by PatentIndex Score
5 records- 0162US9082840B2Coating adhesives onto dicing before grinding and micro-fabricated wafersHenkel IP & Holding GmbH·Filed 2014·Granted Jul 14, 2015·1 cites·3 claims
- 0262US8753959B2Coating adhesives onto dicing before grinding and micro-fabricated wafersYUN HWANG KYU·Filed 2012·Granted Jun 17, 2014·2 cites·5 claims
- 0336US2012261047A1Method to reduce placement voidsPEDDI RAJ·Filed 2012·Application pending·0 cites
- 0433US9607896B2Use of repellent material to protect fabrication regions in semi conductor assemblyHenkel IP & Holding GmbH·Filed 2014·Granted Mar 28, 2017·0 cites·7 claims
- 0530US2013267089A1Film for filling through hole interconnects and post processing for interconnect substratesHENKEL CORPRATION·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →