Inventor · disambiguated record
Ratibor Radojcic
Also filed as: RADOJCIC RATIBOR
13 granted patents·5 pending applications·98 citations·filing 2009–2016
90Inventor score
Top patents by PatentIndex Score
18 records- 0197US9633977B1Integrated device comprising flexible connector between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 25, 2017·32 cites·31 claims
- 0296US9704796B1Integrated device comprising a capacitor that includes multiple pins and at least one pin that traverses a plate of the capacitorQUALCOMM INC·Filed 2016·Granted Jul 11, 2017·22 cites·22 claims
- 0392US9418877B2Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layersQUALCOMM INC·Filed 2014·Granted Aug 16, 2016·14 cites·33 claims
- 0479US9136202B2Enhanced package thermal management using external and internal capacitive thermal materialCHIRIAC VICTOR A·Filed 2012·Granted Sep 15, 2015·7 cites·13 claims
- 0579US8076762B2Variable feature interface that induces a balanced stress to prevent thin die warpageCHANDRASEKARAN ARVIND·Filed 2009·Granted Dec 13, 2011·8 cites·20 claims
- 0678US8633562B2Voltage switchable dielectric for die-level electrostatic discharge (ESD) protectionGU SHIQUN·Filed 2011·Granted Jan 21, 2014·4 cites·11 claims
- 0777US10971476B2Bottom package with metal post interconnectionsQUALCOMM INC·Filed 2014·Granted Apr 6, 2021·4 cites·14 claims
- 0873US9869713B2Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systemsQUALCOMM INC·Filed 2015·Granted Jan 16, 2018·2 cites·27 claims
- 0963US9853446B2Integrated circuit (IC) package comprising electrostatic discharge (ESD) protectionQUALCOMM INC·Filed 2015·Granted Dec 26, 2017·1 cites·23 claims
- 1062US9881859B2Substrate block for PoP packageQUALCOMM INC·Filed 2014·Granted Jan 30, 2018·1 cites·25 claims
- 1161US8803305B2Hybrid package construction with wire bond and through silicon viasRADOJCIC RATIBOR·Filed 2009·Granted Aug 12, 2014·3 cites·20 claims
- 1254US8691707B2Voltage switchable dielectric for die-level electrostatic discharge (ESD) protectionQUALCOMM INC·Filed 2013·Granted Apr 8, 2014·0 cites·11 claims
- 1350US2014225246A1Dual substrate, power distribution and thermal solution for direct stacked integrated devicesQUALCOMM INC·Filed 2013·Application pending·0 cites
- 1447US9285418B2Method and apparatus for characterizing thermal marginality in an integrated circuitQUALCOMM INC·Filed 2013·Granted Mar 15, 2016·0 cites·47 claims
- 1544US2015214127A1Integrated device comprising a substrate with aligning trench and/or cooling cavityQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1644US2016133614A1Semiconductor package with incorporated inductance elementQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1742US2014306349A1Low cost interposer comprising an oxidation layerQUALCOMM INC·Filed 2013·Application pending·0 cites
- 1835US2017005160A1Anchoring conductive material in semiconductor devicesQUALCOMM INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →