Inventor · disambiguated record
Raymond J. Rosner
Also filed as: ROSNER RAYMOND · ROSNER RAYMOND J · ROSNER RAYMOND JAMES
9 granted patents·3 pending applications·183 citations·filing 1995–2010
90Inventor score
Top patents by PatentIndex Score
12 records- 0194US7893468B2Optical sensor including stacked photodiodesIBM·Filed 2008·Granted Feb 22, 2011·25 cites·10 claims
- 0292US7883916B2Optical sensor including stacked photosensitive diodesIBM·Filed 2008·Granted Feb 8, 2011·19 cites·20 claims
- 0385US7917451B2Methods, apparatus, and program products to optimize semiconductor product yield prediction for performance and leakage screensIBM·Filed 2008·Granted Mar 29, 2011·10 cites·20 claims
- 0482US6901542B2Internal cache for on chip test data storageIBM·Filed 2001·Granted May 31, 2005·35 cites·33 claims
- 0576US5770884AVery dense integrated circuit packageIBM·Filed 1995·Granted Jun 23, 1998·33 cites·14 claims
- 0670US7207796B2Hot runner coinjection nozzle with thermally separated melt channelsHUSKY INJECTION MOLDIING SYSTE·Filed 2004·Granted Apr 24, 2007·12 cites·27 claims
- 0770US5866443AVery dense integrated circuit package and method for forming the sameIBM·Filed 1997·Granted Feb 2, 1999·26 cites·8 claims
- 0866US7013441B2Method for modeling integrated circuit yieldIBM·Filed 2003·Granted Mar 14, 2006·15 cites·31 claims
- 0959US2011072409A1Optical sensor including stacked photodiodesIBM·Filed 2010·Application pending·0 cites
- 1058US6675323B2Incremental fault dictionaryIBM·Filed 2001·Granted Jan 6, 2004·8 cites·7 claims
- 1150US2009194910A1Two Stage Spring Pack Device for Hot Runner SealingHUSKY INJECTION MOLDING·Filed 2008·Application pending·0 cites
- 1242US2008178127A1Silicon Multiple Core or Redundant Unit Optimization ToolDEWKETT THOMAS J·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →