Inventor · disambiguated record
Rammil Seguido
Also filed as: SEGUIDO RAMMIL
11 granted patents·25 citations·filing 2002–2021
86Inventor score
Top patents by PatentIndex Score
11 records- 0193US11715677B2Semiconductor device with frame having armsST MICROELECTRONICS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0289US10109563B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2017·Granted Oct 23, 2018·6 cites·25 claims
- 0389US9947612B2Semiconductor device with frame having arms and related methodsST MICROELECTRONICS INC·Filed 2015·Granted Apr 17, 2018·6 cites·20 claims
- 0480US10615104B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2018·Granted Apr 7, 2020·2 cites·17 claims
- 0580US9258890B2Support structure for stacked integrated circuit diesST MICROELECTRONICS INC·Filed 2014·Granted Feb 9, 2016·8 cites·14 claims
- 0679US10957634B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2020·Granted Mar 23, 2021·1 cites·19 claims
- 0771US11552007B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 0864US11688715B2Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frameST MICROELECTRONICS INC·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 0956US11152326B2Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frameST MICROELECTRONICS INC·Filed 2019·Granted Oct 19, 2021·0 cites·21 claims
- 1056US11004776B2Semiconductor device with frame having arms and related methodsST MICROELECTRONICS INC·Filed 2018·Granted May 11, 2021·0 cites·19 claims
- 1132US7089984B2Forming folded-stack packaged device using progressive folding toolINTEL CORP·Filed 2002·Granted Aug 15, 2006·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →