Inventor · disambiguated record
Randall V. Tekavec
Also filed as: TEKAVEC RANDALL V · TEKAVEC RANDALL VAN
2 granted patents·1 pending application·53 citations·filing 1995–2002
64Inventor score
Files withTEXAS INSTRUMENTS INC2
Top patents by PatentIndex Score
3 records- 0168US5558267AMoat for die pad cavity in bond station heater blockTEXAS INSTRUMENTS INC·Filed 1995·Granted Sep 24, 1996·43 cites·10 claims
- 0240US6534337B1Lead frame type plastic ball grid array package with pre-assembled ball type contactsTEXAS INSTRUMENTS INC·Filed 1998·Granted Mar 18, 2003·10 cites·12 claims
- 0333US2003064543A1Method and system for die transferFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →