Inventor · disambiguated record
Raymond E. Wiech, Jr.
Also filed as: WIECH JR RAYMOND E · WIECH RAYMOND E JR
22 granted patents·702 citations·filing 1976–1995
97Inventor score
Files withFINE PARTICLE TECHN CORP9WITEC CAYMAN PATENTS LTD8EDGE ENGINEERING INC1FINE PARTICLE TECHNOLOGY INC1FINE PARTICLES TECHNOLOGY CORP1
Top patents by PatentIndex Score
22 records- 0195US4197118AManufacture of parts from particulate materialPARMATECH CORP·Filed 1976·Granted Apr 8, 1980·97 cites·63 claims
- 0291US4404166AMethod for removing binder from a green bodyWITEC CAYMAN PATENTS LTD·Filed 1981·Granted Sep 13, 1983·63 cites·16 claims
- 0387US4374457AMethod of fabricating complex micro-circuit boards and substratesWIECH RAYMOND E JR·Filed 1980·Granted Feb 22, 1983·73 cites·28 claims
- 0484US4305756AMethod and means for removing binder from a green bodyWITEC CAYMAN PATENTS LTD·Filed 1980·Granted Dec 15, 1981·39 cites·37 claims
- 0583US4722824AMethod of joining green bodies prior to sinteringFINE PARTICLE TECHN CORP·Filed 1986·Granted Feb 2, 1988·40 cites·18 claims
- 0682US4519447ASubstrate coolingFINE PARTICLE TECHN CORP·Filed 1984·Granted May 28, 1985·50 cites·16 claims
- 0782US4415528AMethod of forming shaped metal alloy parts from metal or compound particles of the metal alloy components and compositionsWITEC CAYMAN PATENTS LTD·Filed 1981·Granted Nov 15, 1983·35 cites·18 claims
- 0876US4994215AMethod of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuitsFINE PARTICLE TECHN CORP·Filed 1988·Granted Feb 19, 1991·45 cites·7 claims
- 0976US4531145AMethod of fabricating complex micro-circuit boards and substrates and substrateFINE PARTICLE TECHN CORP·Filed 1982·Granted Jul 23, 1985·38 cites·4 claims
- 1075US4661315AMethod for rapidly removing binder from a green bodyFINE PARTICLE TECHN CORP·Filed 1986·Granted Apr 28, 1987·31 cites·17 claims
- 1174US4510347AFormation of narrow conductive paths on a substrateFINE PARTICLES TECHNOLOGY CORP·Filed 1982·Granted Apr 9, 1985·25 cites·9 claims
- 1266US4562092AMethod of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuitsFINE PARTICLE TECHN CORP·Filed 1984·Granted Dec 31, 1985·26 cites·8 claims
- 1364US4602953AParticulate material feedstock, use of said feedstock and productFINE PARTICLE TECHN CORP·Filed 1985·Granted Jul 29, 1986·19 cites·42 claims
- 1461US4519877AFormation of narrow conductive paths on a substrateFINE PARTICLE TECHN CORP·Filed 1984·Granted May 28, 1985·15 cites·20 claims
- 1554US5613183AManufacture of parts from particulate materialWITEC CAYMAN PATENTS LTD·Filed 1995·Granted Mar 18, 1997·16 cites·30 claims
- 1649US4717340ADebinderizer for rapidly removing binder from a green bodyFINE PARTICLE TECHN CORP·Filed 1986·Granted Jan 5, 1988·10 cites·18 claims
- 1748US5271887AMethod of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuitsWITEC CAYMAN PATENTS LTD·Filed 1993·Granted Dec 21, 1993·17 cites·4 claims
- 1848US4445936AMethod of making inelastically compressible ductile particulate material article and subsequent working thereofWITEC CAYMAN PATENTS LTD·Filed 1981·Granted May 1, 1984·10 cites·8 claims
- 1947US5262122AManufacture of parts from particulate materialWITEC CAYMAN PATENTS LTD·Filed 1991·Granted Nov 16, 1993·11 cites·20 claims
- 2041US5234655AMethod of forming a moldWITEC CAYMAN PATENTS LTD·Filed 1990·Granted Aug 10, 1993·11 cites·6 claims
- 2140US4858324AKnife blades and method of making said knife bladesEDGE ENGINEERING INC·Filed 1986·Granted Aug 22, 1989·23 cites·20 claims
- 2239US4854970AArt mediumFINE PARTICLE TECHNOLOGY INC·Filed 1986·Granted Aug 8, 1989·8 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →