Inventor · disambiguated record
Reynaldo Atienza
Also filed as: ATIENZA JR REYNALDO S · ATIENZA REYNALDO S · ATIENZA REYNALDO S JR
3 granted patents·2 pending applications·20 citations·filing 2002–2006
70Inventor score
Technology areasH10P
Top patents by PatentIndex Score
5 records- 0164US6930276B2Wafer cutting using laser markingINTEL CORP·Filed 2004·Granted Aug 16, 2005·9 cites·10 claims
- 0257US6716723B2Wafer cutting using laser markingINTEL CORP·Filed 2002·Granted Apr 6, 2004·6 cites·18 claims
- 0355US6911377B2Wafer cutting using laser markingINTEL CORP·Filed 2004·Granted Jun 28, 2005·5 cites·16 claims
- 0441US2006185784A1Apparatus, system and method to reduce wafer warpageFUENTES ANASTACIO C JR·Filed 2006·Application pending·0 cites
- 0532US2003209310A1Apparatus, system and method to reduce wafer warpageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →