Inventor · disambiguated record
Remi Brechignac
Also filed as: BRECHIGNAC REMI · BRECHIGNAC RéMI
26 granted patents·2 pending applications·191 citations·filing 1999–2023
95Inventor score
Files withST MICROELECTRONICS SA13ST MICROELECTRONICS GRENOBLE 211COFFY ROMAIN2BRECHIGNAC REMI1ST MICROELECTRONICS SRL1
Top patents by PatentIndex Score
28 records- 0189US11322666B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted May 3, 2022·2 cites·27 claims
- 0287US9136292B2Optical electronic package having a blind cavity for covering an optical sensorCOFFY ROMAIN·Filed 2012·Granted Sep 15, 2015·10 cites·20 claims
- 0382US6893169B1Optical semiconductor package and process for fabricating the sameST MICROELECTRONICS SA·Filed 2000·Granted May 17, 2005·37 cites·26 claims
- 0476US12218287B2Electronic packageST MICROELECTRONICS GRENOBLE 2·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0576US6870238B2Shielded housing for optical semiconductor componentST MICROELECTRONICS SA·Filed 2002·Granted Mar 22, 2005·25 cites·27 claims
- 0673US11908968B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Feb 20, 2024·0 cites·15 claims
- 0771US6969898B1Optical semiconductor housing and method for making sameST MICROELECTRONICS SA·Filed 2000·Granted Nov 29, 2005·19 cites·25 claims
- 0870US7327005B2Optical semiconductor package with incorporated lens and shieldingST MICROELECTRONICS SA·Filed 2002·Granted Feb 5, 2008·18 cites·24 claims
- 0969US11935992B2Electronic device comprising optical electronic components and fabricating processST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Mar 19, 2024·0 cites·16 claims
- 1067US11862757B2Electronic packageST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 1164US11387381B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jul 12, 2022·0 cites·28 claims
- 1263US6713876B1Optical semiconductor housing and method for making sameST MICROELECTRONICS SA·Filed 2000·Granted Mar 30, 2004·12 cites·18 claims
- 1360US11502227B2Electronic device comprising optical electronic components and fabricating processST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Nov 15, 2022·0 cites·18 claims
- 1460US7061697B2Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding deviceST MICROELECTRONICS SRL·Filed 2004·Granted Jun 13, 2006·10 cites·39 claims
- 1556US9006904B2Dual side package on packageST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted Apr 14, 2015·1 cites·12 claims
- 1656US7012331B2Device for mounting a semiconductor package on a support plate via a baseST MICROELECTRONICS SA·Filed 2003·Granted Mar 14, 2006·6 cites·14 claims
- 1755US6374486B1Smart card and process for manufacturing the sameST MICROELECTRONICS SA·Filed 1999·Granted Apr 23, 2002·16 cites·23 claims
- 1853US6597020B1Process for packaging a chip with sensors and semiconductor package containing such a chipST MICROELECTRONICS SA·Filed 2000·Granted Jul 22, 2003·6 cites·24 claims
- 1951US11380663B2Electronic device comprising optical electronic components and manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jul 5, 2022·0 cites·39 claims
- 2050US6696006B2Mold for flashless injection molding to encapsulate an integrated circuit chipST MICROELECTRONICS SA·Filed 2001·Granted Feb 24, 2004·5 cites·18 claims
- 2147US9076749B2Electronic system comprising stacked electronic devices comprising integrated-circuit chipsST MICROELECTRONICS GRENOBLE 2·Filed 2014·Granted Jul 7, 2015·0 cites·16 claims
- 2246US8482116B2Semiconductor device having stacked componentsCOFFY ROMAIN·Filed 2009·Granted Jul 9, 2013·0 cites·17 claims
- 2344US2006012002A1Device for mounting a semiconductor package on a support plate via a baseBRECHIGNAC REMI·Filed 2005·Application pending·0 cites
- 2440US6174113B1Method and apparatus for machining a cavity in a smart cardST MICROELECTRONICS SA·Filed 1999·Granted Jan 16, 2001·13 cites·16 claims
- 2539US6312975B1Semiconductor package and method of manufacturing the sameST MICROELECTRONICS SA·Filed 1999·Granted Nov 6, 2001·11 cites·17 claims
- 2639US2005103987A1Semiconductor component, wafer and package having an optical sensorST MICROELECTRONICS SA·Filed 2004·Application pending·0 cites
- 2738US7326968B2Semiconductor packaging unit with sliding cageST MICROELECTRONICS SA·Filed 2007·Granted Feb 5, 2008·0 cites·27 claims
- 2831US9196590B2Perforated electronic package and method of fabricationST MICROELECTRONICS GRENOBLE 2·Filed 2015·Granted Nov 24, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →