Inventor · disambiguated record
Rensei Futatsuka
Also filed as: FUTATSUKA RENSEI
9 granted patents·175 citations·filing 1979–1998
90Inventor score
Top patents by PatentIndex Score
9 records- 0173US5510197ALead frame material and lead frame for semiconductor deviceMITSUBISHI SHINDO KK·Filed 1994·Granted Apr 23, 1996·51 cites·12 claims
- 0272US5667752ACopper alloy sheet for connectors and connectors formed of sameMITSUBISHI SHINDO KK·Filed 1996·Granted Sep 16, 1997·23 cites·4 claims
- 0361US5885376ACorrosion-resistant high-strength copper based alloy having excellent blankabilityMITSUBISHI SHINDO KK·Filed 1998·Granted Mar 23, 1999·16 cites·21 claims
- 0459US4249941ACopper base alloy for leads of integrated circuitTAMAGAWA KIKAI KINZOKU KK·Filed 1979·Granted Feb 10, 1981·12 cites·1 claims
- 0550US5463247ALead frame material formed of copper alloy for resin sealed type semiconductor devicesMITSUBISHI SHINDO KK·Filed 1994·Granted Oct 31, 1995·19 cites·8 claims
- 0649US4668471ACopper alloy lead material for leads of a semiconductor deviceMITSUBISHI SHINDO KK·Filed 1985·Granted May 26, 1987·18 cites·17 claims
- 0748US4750029ACopper base lead material for leads of semiconductor devicesMITSUBISHI SHINDO KK·Filed 1987·Granted Jun 7, 1988·15 cites·8 claims
- 0845US5997810AHigh-strength copper based alloy free from smutting during pretreatment for platingMITSUBISHI SHINDO KK·Filed 1997·Granted Dec 7, 1999·8 cites·3 claims
- 0941US4877577ACopper alloy lead frame material for semiconductor devicesMITSUBISHI SHINDO KK·Filed 1988·Granted Oct 31, 1989·13 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →