Inventor · disambiguated record
Reo Hanada
Also filed as: HANADA REO
1 granted patent·3 pending applications·0 citations·filing 2018–2025
8Inventor score
Files withTDK CORP4
Top patents by PatentIndex Score
4 records- 0141US10741502B2Multilayer circuit boardTDK CORP·Filed 2018·Granted Aug 11, 2020·0 cites·20 claims
- 0241US2024155765A1Electronic component embedded substrate and manufacturing method thereforTDK CORP·Filed 2022·Application pending·0 cites
- 0340US2025239529A1Semiconductor moduleTDK CORP·Filed 2025·Application pending·0 cites
- 0440US2025239533A1Semiconductor moduleTDK CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →