Inventor · disambiguated record

Reuy-Shing Huang

Also filed as: HUANG REUY-SHING

1 granted patent·12 citations·filing 2003–2003

34Inventor score

Technology areasH10P

Files withASIA PACIFIC MICROSYSTEMS INC1

Top patents by PatentIndex Score

1 record

0159US6967145B2Method of maintaining photolithographic precision alignment after wafer bonding processASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Nov 22, 2005·12 cites·4 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →