Inventor · disambiguated record
Rena Kojima
Also filed as: KOJIMA RENA
1 granted patent·2 pending applications·0 citations·filing 2021–2022
11Inventor score
Files withNITTO DENKO CORP3
Top patents by PatentIndex Score
3 records- 0157US2022325091A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0253US11791302B2Thermosetting sheet, dicing die bonding film, and semiconductor apparatusNITTO DENKO CORP·Filed 2021·Granted Oct 17, 2023·0 cites·5 claims
- 0340US2021403784A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →