Inventor · disambiguated record
Ren-Dou Lee
Also filed as: LEE REN-DOU
21 granted patents·3 pending applications·26 citations·filing 2002–2025
91Inventor score
Top patents by PatentIndex Score
24 records- 0188US11380569B2Shiftless wafer bladesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 0286US10699931B2Shiftless wafer bladesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·4 cites·20 claims
- 0382US9884755B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 0482US2024383095A1Multi-layered windows for use in chemical-mechanical planarization systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0581US11851325B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 26, 2023·2 cites·20 claims
- 0680US12234145B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0779US10173886B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 8, 2019·1 cites·20 claims
- 0876US9127356B2Sputtering target with reverse erosion profile surface and sputtering system and method using the sameCHUEH CHIA-LIANG·Filed 2011·Granted Sep 8, 2015·2 cites·18 claims
- 0973US11688620B2Shiftless wafer bladesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·0 cites·20 claims
- 1070US2025154000A1Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1169US11850702B2Chemical mechanical planarization membraneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1267US11034578B2Multi-layer sealing film for high seal yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·20 claims
- 1366US12138735B2Multi-layered windows for use in chemical-mechanical planarization systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 12, 2024·0 cites·20 claims
- 1465US10759654B2Rough anti-stiction layer for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
- 1565US9481567B2MEMS structure, cap substrate and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·1 cites·19 claims
- 1665US6531415B1Silicon nitride furnace tube low temperature cycle purge for attenuated particle formationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 11, 2003·12 cites·14 claims
- 1763US11192778B2MEMS package with roughend interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 1862US10676343B2Multi-layer sealing film for high seal yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 1959US10322928B2Multi-layer sealing film for high seal yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 2056US2023256561A1Method of chemical mechanical polish operation and chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2154US10710872B2MEMS package with roughend interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 14, 2020·0 cites·20 claims
- 2252US11267099B2Chemical mechanical planarization membraneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 8, 2022·0 cites·20 claims
- 2347US10319557B2Ion generator and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 2447US9230918B1Semiconductor package structure, alignment structure, and alignment methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 5, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →