Inventor · disambiguated record
Re-Ching Lin
Also filed as: LIN RE-CHING
16 granted patents·6 pending applications·20 citations·filing 2012–2023
88Inventor score
Files withWIN SEMICONDUCTORS CORP11WUHAN YANXI MICRO COMPONENTS CO LTD8IND TECH RES INST2CHEN YING-CHUNG1
Top patents by PatentIndex Score
22 records- 0185US10097156B2Resonance structure of bulk acoustic wave resonatorWIN SEMICONDUCTORS CORP·Filed 2016·Granted Oct 9, 2018·6 cites·31 claims
- 0283US9998087B2Acoustic wave device structure, integrated structure of power amplifier and acoustic wave deviceWIN SEMICONDUCTORS CORP·Filed 2017·Granted Jun 12, 2018·4 cites·35 claims
- 0379US9653516B2Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereofWIN SEMICONDUCTORS CORP·Filed 2014·Granted May 16, 2017·5 cites·34 claims
- 0479US9391239B2Light emitting diodeIND TECH RES INST·Filed 2014·Granted Jul 12, 2016·3 cites·19 claims
- 0567US2024405746A1Bulk acoustic wave resonant structure and preparation method therefor, and acoustic wave deviceWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2022·Application pending·0 cites
- 0667US2025226811A1Bulk acoustic wave resonant structure and preparation method therefor, and acoustic wave deviceWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2022·Application pending·0 cites
- 0767US2024396523A1Bulk acoustic wave resonance structure and preparation method therefor, and acoustic wave deviceWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2022·Application pending·0 cites
- 0862US9140671B2Quantitative sensor and manufacturing method thereofCHEN YING-CHUNG·Filed 2012·Granted Sep 22, 2015·2 cites·14 claims
- 0958US10103624B2Thermal sensor circuitWIN SEMICONDUCTORS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·10 claims
- 1055US9231168B2Light emitting diode package structureIND TECH RES INST·Filed 2014·Granted Jan 5, 2016·0 cites·18 claims
- 1153US10756625B2Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereofWIN SEMICONDUCTORS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·64 claims
- 1253US10727741B2Thermal sensing acoustic wave resonator and acoustic wave filter having thermal sensing acoustic wave resonatorWIN SEMICONDUCTORS CORP·Filed 2017·Granted Jul 28, 2020·0 cites·19 claims
- 1349US11130671B2MEMS device and fabrication method thereofWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·17 claims
- 1448US2023091905A1Acoustic device and method for manufacturing the sameWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2022·Application pending·0 cites
- 1543US2024072764A1Bulk acoustic wave resonant structure and manufacturing method thereforWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2023·Application pending·0 cites
- 1642US10498310B2Protective cover for an acoustic wave device and fabrication method thereofWIN SEMICONDUCTORS CORP·Filed 2016·Granted Dec 3, 2019·0 cites·10 claims
- 1739US10298203B2Protection structure for semiconductor device packageWIN SEMICONDUCTORS CORP·Filed 2017·Granted May 21, 2019·0 cites·22 claims
- 1838US11539340B2Film bulk acoustic resonatorWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2019·Granted Dec 27, 2022·0 cites·17 claims
- 1938US11362633B2Acoustic wave device and fabrication method thereofWUHAN YANXI MICRO COMPONENTS CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·8 claims
- 2037US9905610B2Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereofWIN SEMICONDUCTORS CORP·Filed 2017·Granted Feb 27, 2018·0 cites·78 claims
- 2135US10453805B2Protection structure for semiconductor device packageWIN SEMICONDUCTORS CORP·Filed 2016·Granted Oct 22, 2019·0 cites·13 claims
- 2234US2017272052A1Protective Cover for an Acoustic Wave Device and Fabrication Method ThereofWIN SEMICONDUCTORS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →