Inventor · disambiguated record
Reggie Phillips
Also filed as: PHILLIPS REGGIE
6 granted patents·1 pending application·61 citations·filing 2010–2016
81Inventor score
Top patents by PatentIndex Score
7 records- 0191US8902565B2Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastesMCCONNELL JOHN E·Filed 2011·Granted Dec 2, 2014·19 cites·18 claims
- 0290US9799449B2Multilayered ceramic capacitor with improved lead frame attachmentKEMET ELECTRONICS CORP·Filed 2014·Granted Oct 24, 2017·13 cites·41 claims
- 0388US8873219B2Method for stacking electronic componentsPEREA MAURICE·Filed 2012·Granted Oct 28, 2014·17 cites·30 claims
- 0488US8331078B2Leaded multi-layer ceramic capacitor with low ESL and low ESRMCCONNELL JOHN E·Filed 2010·Granted Dec 11, 2012·12 cites·30 claims
- 0557US9847175B2Method for stacking electronic componentsKEMET ELECTRONICS CORP·Filed 2014·Granted Dec 19, 2017·0 cites·30 claims
- 0653US10068708B2Method for stacking electronic componentsKEMET ELECTRONICS CORP·Filed 2016·Granted Sep 4, 2018·0 cites·28 claims
- 0740US2013107419A1Multilayered ceramic capacitor with improved lead frame attachmentHILL R ALLEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →