Inventor · disambiguated record
Reynaldo Rincon
Also filed as: RINCON REYNALDO · RINCON REYNALDO M
10 granted patents·5 pending applications·347 citations·filing 1997–2007
91Inventor score
Top patents by PatentIndex Score
15 records- 0198US7026833B2Multiple-chip probe and universal tester contact assemblageTEXAS INSTRUMENTS INC·Filed 2005·Granted Apr 11, 2006·123 cites·4 claims
- 0293US6906539B2High density, area array probe card apparatusTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 14, 2005·63 cites·18 claims
- 0391US6970005B2Multiple-chip probe and universal tester contact assemblageTEXAS INSTRUMENTS INC·Filed 2001·Granted Nov 29, 2005·47 cites·17 claims
- 0490US6911834B2Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probingTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 28, 2005·63 cites·22 claims
- 0574US6586839B2Approach to structurally reinforcing the mechanical performance of silicon level interconnect layersTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 1, 2003·23 cites·9 claims
- 0673US6636063B2Probe card with contact apparatus and method of manufactureTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 21, 2003·18 cites·22 claims
- 0762US7679383B2Cantilever probe cardSV PROBE PTE LTD·Filed 2007·Granted Mar 16, 2010·4 cites·22 claims
- 0858US6752012B2Combined electrical test and mechanical test system for thin film characterizationTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 22, 2004·2 cites·9 claims
- 0943US2005140382A1High density, area array probe card apparatusFiled 2005·Application pending·0 cites
- 1036US2003116346A1Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machineFiled 2001·Application pending·0 cites
- 1135US6720780B2High density probe card apparatus and method of manufactureTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 13, 2004·0 cites·25 claims
- 1235US2004169521A1High density probe card apparatus and method of manufactureFiled 2004·Application pending·0 cites
- 1334US2003107137A1Micromechanical device contact terminals free of particle generationFiled 2001·Application pending·0 cites
- 1434US2003094962A1Dual plane probe card assembly and method of manufactureFiled 2001·Application pending·0 cites
- 1529US5981370AMethod for maximizing interconnection integrity and reliability between integrated circuits and external connectionsTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 9, 1999·4 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →