Inventor · disambiguated record
Rennier Rodriguez
Also filed as: RODRIGUEZ RENNIER · RODRIGUEZ RENNIER SARMIENTO
18 granted patents·5 pending applications·24 citations·filing 2016–2025
90Inventor score
Top patents by PatentIndex Score
23 records- 0189US10109563B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2017·Granted Oct 23, 2018·6 cites·25 claims
- 0288US9953933B1Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor dieST MICROELECTRONICS INC·Filed 2017·Granted Apr 24, 2018·7 cites·19 claims
- 0386US11404355B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0480US10615104B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2018·Granted Apr 7, 2020·2 cites·17 claims
- 0580US10535588B2Die with metallized sidewall and method of manufacturingST MICROELECTRONICS INC·Filed 2017·Granted Jan 14, 2020·3 cites·19 claims
- 0679US10957634B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2020·Granted Mar 23, 2021·1 cites·19 claims
- 0776US12170240B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0873US10763194B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS INC·Filed 2017·Granted Sep 1, 2020·2 cites·20 claims
- 0971US11552007B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1069US12074100B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 1169US11664239B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2021·Granted May 30, 2023·0 cites·12 claims
- 1268US12159820B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2020·Granted Dec 3, 2024·0 cites·20 claims
- 1366US10796984B2Leadframe having a conductive layer protruding through a lead recessST MICROELECTRONICS INC·Filed 2019·Granted Oct 6, 2020·1 cites·21 claims
- 1464US11688715B2Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frameST MICROELECTRONICS INC·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 1559US11037864B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2019·Granted Jun 15, 2021·0 cites·18 claims
- 1657US2025385162A1Semiconductor device assemblies with wettable die attach area and associated methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1756US11152326B2Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frameST MICROELECTRONICS INC·Filed 2019·Granted Oct 19, 2021·0 cites·21 claims
- 1854US10892212B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2017·Granted Jan 12, 2021·0 cites·15 claims
- 1954US2025192090A1Semiconductor devices with sidewall recessesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 2050US2022139845A1Semiconductor package with electromagnetic shieldST MICROELECTRONICS INC·Filed 2021·Application pending·0 cites
- 2145US2021391226A1Semiconductor device packages having cap with integrated electrical leadsST MICROELECTRONICS INC·Filed 2021·Application pending·0 cites
- 2242US2018190575A1Leadframe with lead protruding from the packageST MICROELECTRONICS INC·Filed 2017·Application pending·0 cites
- 2338US9761538B1Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layerST MICROELECTRONICS INC·Filed 2016·Granted Sep 12, 2017·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →