Inventor · disambiguated record
Rengarajan Shanmugam
Also filed as: SHANMUGAM RENGARAJAN
7 granted patents·17 pending applications·0 citations·filing 2017–2024
67Inventor score
Top patents by PatentIndex Score
24 records- 0159US12349282B2Capacitors in through glass viasINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 0258US2025210506A1Passivation boundary defects for reduced leakage current capacitor dielectric materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 0358US2025218956A1Methods and apparatus for mounting semiconductor devices in cavitiesINTEL CORP·Filed 2023·Application pending·0 cites
- 0457US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0555US2025006646A1Through glass vias with compliant layer for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0654US2024321657A1Photonic integrated circuit packages and methods of manufacturing the sameINTEL CORP·Filed 2023·Application pending·0 cites
- 0753US2025106997A1Electroless seed layer deposition on glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0853US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 0952US2023420358A1Integrated circuit packages with silver and silicon nitride multi-layerINTEL CORP·Filed 2022·Application pending·0 cites
- 1052US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1151US12476175B2Glass substrates having transverse capacitors for use with semiconductor packages and related methodsINTEL CORP·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 1251US2024213301A1Thin film capacitor (tfc) architectures for package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1351US2025006614A1Intervening layers for thru-via seed metallizationSHANMUGAM RENGARAJAN·Filed 2023·Application pending·0 cites
- 1450US2024006258A1Substrates with nitrided glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 1549US12159844B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Dec 3, 2024·0 cites·20 claims
- 1649US2024332153A1Dry seed removal by laser for line-space and via formationINTEL CORP·Filed 2023·Application pending·0 cites
- 1748US11574993B2Package architecture with tunable magnetic properties for embedded devicesINTEL CORP·Filed 2019·Granted Feb 7, 2023·0 cites·15 claims
- 1847US12416093B2Electroless plating processINTEL CORP·Filed 2021·Granted Sep 16, 2025·0 cites·13 claims
- 1947US2024188225A1Glass coating to minimize roughness inside through glass viasINTEL CORP·Filed 2022·Application pending·0 cites
- 2045US2023107096A1Through glass via with a metal wallINTEL CORP·Filed 2021·Application pending·0 cites
- 2144US2023082385A1Defect-free through glass via metallization implementing a reverse filling architectureECTON JEREMY D·Filed 2021·Application pending·0 cites
- 2241US11728265B2Selective deposition of embedded thin-film resistors for semiconductor packagingINTEL CORP·Filed 2018·Granted Aug 15, 2023·0 cites·15 claims
- 2341US11291122B2Apparatus with a substrate provided with plasma treatmentINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·14 claims
- 2439US2021090946A1Multiple layer copper seedingINTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →