Inventor · disambiguated record
Real Tetreault
Also filed as: TETREAULT REAL · TETREAULT REAL JOSEPH
9 granted patents·215 citations·filing 1997–2005
90Inventor score
Files withIBM9
Top patents by PatentIndex Score
9 records- 0190US6508595B1Assembly of opto-electronic module with improved heat sinkIBM·Filed 2000·Granted Jan 21, 2003·58 cites·11 claims
- 0280US6822875B2Assembly of opto-electronic module with improved heat sinkIBM·Filed 2002·Granted Nov 23, 2004·27 cites·2 claims
- 0379US6547452B1Alignment systems for subassemblies of overmolded optoelectronic modulesIBM·Filed 2000·Granted Apr 15, 2003·22 cites·12 claims
- 0476US6988882B2Transfer molding of integrated circuit packagesIBM·Filed 2005·Granted Jan 24, 2006·7 cites·16 claims
- 0565US5997798ABiasing mold for integrated circuit chip assembly encapsulationIBM·Filed 1997·Granted Dec 7, 1999·31 cites·9 claims
- 0665US5939778AIntegrated circuit chip packageIBM·Filed 1997·Granted Aug 17, 1999·32 cites·8 claims
- 0761US6956296B2Transfer molding of integrated circuit packagesIBM·Filed 2003·Granted Oct 18, 2005·9 cites·3 claims
- 0861US6656773B2Transfer molding of integrated circuit packagesIBM·Filed 2002·Granted Dec 2, 2003·9 cites·10 claims
- 0954US6309575B1Transfer molding method for forming integrated circuit packageIBM·Filed 1999·Granted Oct 30, 2001·20 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →