Inventor · disambiguated record
Rebecca Tishkoff
Also filed as: TISHKOFF REBECCA · TISHKOFF REBECCA L
2 granted patents·80 citations·filing 2001–2001
67Inventor score
Files withHENKEL CORP2
Top patents by PatentIndex Score
2 records- 0184US7109061B2Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewithHENKEL CORP·Filed 2001·Granted Sep 19, 2006·51 cites·27 claims
- 0284US6887737B1Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefromHENKEL CORP·Filed 2001·Granted May 3, 2005·29 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →