Inventor · disambiguated record
Ren-Fen Tsui
Also filed as: TSUI REN-FEN
26 granted patents·12 pending applications·37 citations·filing 2004–2025
94Inventor score
Top patents by PatentIndex Score
38 records- 0194US10297602B2Implantations for forming source/drain regions of different transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·7 cites·20 claims
- 0292US10269704B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·5 cites·20 claims
- 0388US2025294862A1Semiconductor device with contracted isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0487US12414281B2Implantations for forming source/drain regions of different transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 0587US10373879B2Semiconductor device with contracted isolation feature and formation method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 6, 2019·3 cites·20 claims
- 0687US2025357724A1Optical package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0786US9805815B1Electrical fuse bit cell and mask setTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·4 cites·20 claims
- 0885US9871046B2SRAM circuits with aligned gate electrodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·3 cites·20 claims
- 0984US11037934B2SRAM circuits with aligned gate electrodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
- 1084US2025286344A1Optical package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1183US9978680B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 22, 2018·2 cites·20 claims
- 1282US12041761B2SRAM circuits with aligned gate electrodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1382US11895819B2Implantations for forming source/drain regions of different transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 1482US10332896B2SRAM circuits with aligned gate electrodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·2 cites·20 claims
- 1582US9666587B1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·2 cites·20 claims
- 1680US2025355175A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1779US12324222B2Semiconductor device with contracted isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1879US2025164690A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1976US11145660B2Dual-port SRAM cell structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·2 cites·20 claims
- 2075US11605637B2SRAM circuits with aligned gate electrodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 2174US11251091B2Semiconductor device with contracted isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 2273US12033940B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 9, 2024·0 cites·20 claims
- 2373US11527540B2Implantations for forming source/drain regions of different transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 2468US10930590B1Interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·1 cites·18 claims
- 2567US10811321B2Semiconductor device with contracted isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·0 cites·20 claims
- 2666US10685967B2Implantations for forming source/drain regions of different transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 16, 2020·0 cites·20 claims
- 2764US10847457B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 2861US2025216600A1Method of forming an integrated optical chip package device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2959US11532554B2Interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3059US2025174586A1Semiconductor structure having optical component and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3157US2025253298A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3257US2025362451A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3355US2025372552A1Bonded structure with half-oval bonding pad pair design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3453US11189340B1Circuit in memory device for parasitic resistance reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 3551US2025060534A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3650US7705464B2Connection structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 27, 2010·4 cites·34 claims
- 3742US2007257323A1Stacked contact structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3839US10163494B1Memory device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →