Inventor · disambiguated record
Reinhold Wahlich
Also filed as: WAHLICH REINHOLD
22 granted patents·4 pending applications·270 citations·filing 1984–2011
95Inventor score
Files withSILTRONIC AG20WACKER CHEMITRONIC2GRAEF DIETER1MURPHY BRIAN1WACKER SILTRONIC GES FUR HALBLE1
Top patents by PatentIndex Score
26 records- 0190US5935320AProcess for producing silicon semiconductor wafers with low defect densityWACKER SILTRONIC HALBLEITERMAT·Filed 1997·Granted Aug 10, 1999·148 cites·4 claims
- 0289US8395164B2Multilayered semiconductor wafer and process for manufacturing the sameMURPHY BRIAN·Filed 2011·Granted Mar 12, 2013·11 cites·14 claims
- 0388US7828893B2Silicon wafer and process for the heat treatment of a silicon waferSILTRONIC AG·Filed 2006·Granted Nov 9, 2010·15 cites·15 claims
- 0480US8039361B2Multilayered semiconductor wafer and process for manufacturing the sameSILTRONIC AG·Filed 2007·Granted Oct 18, 2011·8 cites·17 claims
- 0577US7052948B2Film or layer made of semi-conductive material and method for producing said film or layerSILTRONIC AG·Filed 2002·Granted May 30, 2006·23 cites·39 claims
- 0675US7417297B2Film or layer of semiconducting material, and process for producing the film or layerSILTRONIC AG·Filed 2006·Granted Aug 26, 2008·6 cites·10 claims
- 0775US7394129B2SOI wafer and method for producing itSILTRONIC AG·Filed 2005·Granted Jul 1, 2008·5 cites·10 claims
- 0874US7407891B2Method and apparatus for leveling a semiconductor wafer, and semiconductor wafer with improved flatnessSILTRONIC AG·Filed 2005·Granted Aug 5, 2008·5 cites·20 claims
- 0973US8323403B2SOI wafer and method for producing itGRAEF DIETER·Filed 2008·Granted Dec 4, 2012·6 cites·18 claims
- 1072US7803695B2Semiconductor substrate and process for producing itSILTRONIC AG·Filed 2008·Granted Sep 28, 2010·3 cites·9 claims
- 1168US7491966B2Semiconductor substrate and process for producing itSILTRONIC AG·Filed 2005·Granted Feb 17, 2009·2 cites·8 claims
- 1268US7279700B2Semiconductor substrate and process for producing itSILTRONIC AG·Filed 2005·Granted Oct 9, 2007·2 cites·9 claims
- 1368US6803331B2Process for the heat treatment of a silicon wafer, and silicon wafer producedSILTRONIC AG·Filed 2003·Granted Oct 12, 2004·13 cites·11 claims
- 1465US7537657B2Silicon wafer and process for producing itSILTRONIC AG·Filed 2006·Granted May 26, 2009·2 cites·27 claims
- 1560US7799692B2Method and apparatus for the treatment of a semiconductor waferSILTRONIC AG·Filed 2007·Granted Sep 21, 2010·1 cites·13 claims
- 1658US7122865B2SOI wafer and process for producing itSILTRONIC AG·Filed 2004·Granted Oct 17, 2006·8 cites·11 claims
- 1751US7820549B2Layered semiconductor wafer with low warp and bow, and process for producing itSILTRONIC AG·Filed 2008·Granted Oct 26, 2010·0 cites·20 claims
- 1851US2007281441A1Semiconductor substrate and process for producing itSILTRONIC AG·Filed 2007·Application pending·0 cites
- 1945US2006046431A1Layered semiconductor wafer with low warp and bow, and process for producing itSILTRONIC AG·Filed 2005·Application pending·0 cites
- 2044US7988876B2Method for reducing and homogenizing the thickness of a semiconductor layer which lies on the surface of an electrically insulating materialSILTRONIC AG·Filed 2008·Granted Aug 2, 2011·0 cites·13 claims
- 2142US7235863B2Silicon wafer and process for producing itSILTRONIC AG·Filed 2004·Granted Jun 26, 2007·0 cites·6 claims
- 2242US6579589B1Semiconductor wafer with crystal lattice defects, and process for producing this semiconductor waferWACKER SILTRONIC GES FUR HALBLE·Filed 2000·Granted Jun 17, 2003·3 cites·7 claims
- 2341US2006145188A1Semiconductor wafer having a silicon-germanium layer, and method for its productionSILTRONIC AG·Filed 2006·Application pending·0 cites
- 2441US2006138540A1Semiconductor wafer having a semiconductor layer and an electrically insulating layer beneath it, and process for producing itSILTRONIC AG·Filed 2005·Application pending·0 cites
- 2534US5164323AProcess for the surface treatment of semiconductor slicesWACKER CHEMITRONIC·Filed 1990·Granted Nov 17, 1992·7 cites·6 claims
- 2629US5133160AProcess for the removal of specific crystal structures defects from semiconductor discsWACKER CHEMITRONIC·Filed 1984·Granted Jul 28, 1992·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →