Inventor · disambiguated record
Rees Winters
Also filed as: WINTERS REES
3 granted patents·0 citations·filing 2018–2023
45Inventor score
Technology areasH10W
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0167US12406906B2Through mold interconnect drill featureINTEL CORP·Filed 2023·Granted Sep 2, 2025·0 cites·22 claims
- 0256US11705383B2Through mold interconnect drill featureINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·23 claims
- 0345US11462527B2Micro-trenching mold interface in a pop packageINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →